Circuit Board Assembly With Edge Connectors for Shorter Signal Paths
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional circuit board assemblies in data centers face issues with overlong signal transmission paths, leading to poor high-frequency and high-speed data transmission quality and increased manufacturing costs due to the use of multiple backplane connectors.
Innovation Solution
A circuit board assembly design that reduces signal transmission paths by using X-Beam connectors and flexible printed circuit boards to directly connect processors on adjacent circuit boards, eliminating the need for backplane connectors and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If signals are transmitted through a backplane to another circuit board, then circuit boards can be connected, but the signal transmission path becomes overlong
Solution Approach 1:
The patent extracts and removes the backplane from the signal transmission path. Instead of routing signals through the backplane, the invention directly connects circuit boards using edge-to-edge connectors, eliminating the intermediate backplane component and significantly shortening the signal transmission path.
Solution Approach 2:
The patent introduces edge-to-edge connectors as a new intermediary mechanism to replace the backplane. These connectors enable direct electrical connection between adjacent circuit boards, serving as a more efficient mediator for signal transmission compared to the traditional backplane approach.
2Ease of operation
If multiple backplane connectors are used to connect circuit boards, then connectivity is achieved, but manufacturing cost increases
Solution Approach 1:
The patent merges multiple backplane connector functions into a single edge-to-edge connector interface. By combining the connectivity functions that previously required multiple separate backplane connectors into one integrated edge connection, the system reduces component count and manufacturing complexity.
Solution Approach 2:
The patent replaces expensive, complex backplane connectors with simpler, more cost-effective edge-to-edge connectors. These simplified connectors are easier to manufacture and assemble, reducing overall manufacturing costs while maintaining the required connectivity functionality.
3Ease of operation
If multiple backplane connectors are used to connect circuit boards, then connectivity is achieved, but transmission quality deteriorates
Solution Approach 1:
The patent extracts and eliminates the backplane connectors from the signal path, removing the source of transmission quality degradation. By taking out these problematic connectors and replacing them with direct edge-to-edge connections, high-frequency signal integrity is preserved.
Solution Approach 2:
The patent introduces edge-to-edge connectors as a superior intermediary for high-frequency signal transmission. This new mediator provides better electrical characteristics and signal integrity compared to traditional backplane connectors, enabling reliable high-frequency and high-speed data transmissions.
Data Source
AI summary
A circuit board assembly is provided and includes a first circuit board, a second circuit board and a first connecting module. The first connecting module includes a first connecting wire, a first connector and a second connector. The first circuit board includes a first processor, and the second circuit board includes a second processor. One end of the first connector is connected to one end of the first connecting wire, and the other end of the first connector is connected to the first circuit board. One end of the second connector is connected to the other end of the first connecting wire, and the other end of the second connector is connected to the second circuit board. The first connector is adjacent to the first processor, and the second connector is adjacent to the second processor.