Circuit Board Side-Wire Layout to Prevent Glass Edge Delamination
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Solution Overview
Problem
Delamination issues occur when processing the side surfaces of glass substrates in display devices due to the deposition of multiple insulating and conductive layers, necessitating a method to prevent such failures.
Innovation Solution
A circuit board design incorporating a removal region between the pad structure and the side surface of the substrate, with a side wire extending from the pad structure to the second surface, reducing the risk of delamination by minimizing damage during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple layers of insulating material and conductive material are deposited on the glass substrate to create circuit structures, then the circuit functionality is improved, but the risk of delamination during side surface processing increases
Solution Approach 1:
The patent applies preliminary action by forming a removal region in the insulating structure before side surface processing occurs. This removal region is created in advance to prevent delamination that would otherwise happen during subsequent cutting or polishing operations. By preparing this stress-relief structure beforehand, the patent eliminates the need for complex post-processing repairs while maintaining layer adhesion integrity.
Solution Approach 2:
The patent extracts or removes a portion of the insulating structure to create the removal region. This extracted region is specifically positioned between the pad structure and the side surface of the substrate. By taking out this portion of the insulating material, the patent reduces the overall stress on the deposited layers during side surface processing, thereby preventing delamination while preserving the necessary circuit functionality.
2Shape
If the side surfaces of the glass substrate are processed to create specific shapes or dimensions, then the display device form factor is improved, but delamination of insulating and conductive layers occurs
Solution Approach 1:
The removal region is formed in advance before side surface processing. This preliminary structure preparation allows the substrate to be cut or polished into specific shapes without causing delamination. The removal region acts as a pre-configured stress management feature that protects the deposited layers during form factor customization.
Solution Approach 2:
The patent applies local quality by creating a removal region with specific characteristics in a localized area between the pad structure and the side surface. This localized modification changes the stress distribution only where needed, allowing the rest of the insulating structure to maintain its integrity and protective function while enabling side surface processing for various display device shapes.
3Strength
If the insulating structure is kept intact near the side surface, then structural support is improved, but processing the side surface causes delamination
Solution Approach 1:
The patent extracts a specific portion of the insulating structure to create the removal region, strategically positioned between the pad structure and the side surface. This selective removal reduces stress concentration during side surface processing while preserving the overall structural support provided by the remaining insulating material. The extracted region acts as a stress relief zone that enables easier manufacturing without compromising essential structural integrity.
Solution Approach 2:
By creating a localized removal region with different properties than the surrounding insulating structure, the patent achieves local quality optimization. The removal region provides stress relief for manufacturing purposes, while the surrounding intact insulating structure maintains structural support. This localized modification allows side surface processing to proceed more easily without causing delamination, balancing manufacturing ease with structural requirements.
Data Source
AI summary
A circuit board includes a substrate, an insulating structure, a pad structure and a side wire. The substrate has a first surface, a second surface opposite to the first surface, and a side surface. The insulating structure is located above the first surface of the substrate. The pad structure is located in the insulating structure. The insulating structure includes an opening on the pad structure and a removal region between the pad structure and the side surface of the substrate. At least a portion of the insulating structure in the removal region is removed, and the horizontal distance between the removal region and the pad structure is H, 0<H≤10 micrometers. The side wire is filled into the opening of the insulating structure, and extends from the pad structure to the second surface of the substrate.