Electroacoustic Device Circuit-Board End Cover for Compact Assembly
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Solution Overview
Problem
Existing electroacoustic devices face challenges in achieving lightweight and compact designs due to traditional assembly methods that are labor-intensive and inefficient, leading to high material usage and reduced market competitiveness.
Innovation Solution
The electroacoustic device incorporates a circuit-board end cover with a wiring board module, elastic conductive members, and complementary coupling portions to simplify assembly, reduce thickness, and enhance electrical connectivity, using a top cover with a sunken portion and a rim for secure attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional assembly methods are used to weld electroacoustic components on circuit boards, then electrical connectivity is achieved, but manufacturing complexity increases and productivity decreases
Solution Approach 1:
The patent merges the circuit board and end cover into a single integrated component. The circuit board includes an end cover portion that is integrally formed with the circuit board body, eliminating the need for separate welding operations and reducing assembly steps while maintaining electrical connectivity through conductive patterns on the integrated surface.
Solution Approach 2:
The integrated circuit board-end cover structure performs multiple functions simultaneously: it provides mechanical support, electrical connectivity, and structural enclosure. The conductive patterns on the integrated surface serve both as circuit traces and as bonding surfaces for electroacoustic components, reducing the number of separate functional elements needed.
2Loss of substance
If traditional welding methods are used, then electrical connection is established, but material usage increases and labor time increases
Solution Approach 1:
The patent extracts the end cover function from a separate component and integrates it into the circuit board structure. This eliminates the need for additional welding materials and reduces labor time by removing the separate assembly step, while the conductive patterns maintain necessary electrical connections without requiring traditional welding processes.
3Loss of substance
If the electroacoustic component thickness is increased to save materials, then material efficiency improves, but device compactness deteriorates
Solution Approach 1:
The patent optimizes material efficiency not by increasing thickness in the vertical dimension, but by improving the planar utilization of the circuit board surface. The conductive patterns and component mounting areas are arranged to maximize the use of available surface area, achieving material efficiency through two-dimensional optimization rather than three-dimensional expansion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the structure, reduces overall thickness, saves materials, and shortens labor hours, thereby improving product competitiveness and manufacturing efficiency.
Implementation Method 1
The elastic conductive member is fixed on the wiring board module and electrically connected the wiring board module and the electro-acoustic unit
Data Source
AI summary
An electroacoustic device includes a top cover, an electro-acoustic unit and a circuit-board end cover. One end surface of the top cover is formed with a sunken portion and a first coupling portion. The electro-acoustic unit is fixed within the sunken portion. The circuit-board end cover completely covers the sunken portion. The circuit-board end cover includes a wiring board module, an elastic conductive member and a second coupling portion. The elastic conductive member is electrically connected the wiring board module and the electro-acoustic unit. The second coupling portion is located on the wiring board module and connected to the first coupling portion.