Circuit Board ESD Protection via Vertical Conductive Element
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Solution Overview
Problem
Existing circuit boards with electrostatic discharge (ESD) protection components occupy valuable space, limiting the layout of signal traces and reducing design flexibility, as additional ESD protection components may not fit due to area constraints.
Innovation Solution
A circuit board design featuring a conductive element stereoscopically disposed on the ground plane, crossing over signal traces with discharging portions that allow for electrostatic discharge without occupying wiring area, using a formula to determine the minimum discharge voltage based on gap distance and atmospheric pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ESD protection components are disposed on the circuit board, then electrostatic discharge protection function is improved, but area available for wiring is reduced
Solution Approach 1:
The conductive element is extended from the ground plane in a direction substantially perpendicular to the circuit board, creating a three-dimensional structure that protrudes toward the signal trace. This vertical dimensionality change allows the ESD protection function to be achieved without occupying additional planar wiring area on the circuit board surface.
Solution Approach 2:
The conductive element is integrated within the existing ground plane structure, nesting the ESD protection mechanism inside the circuit board's existing layered architecture. The conductive element is electrically connected to the ground plane and positioned within the space above it, utilizing the existing structural volume rather than adding external components.
2Reliability
If ESD protection components are disposed on the circuit board, then electrostatic discharge protection function is improved, but layout flexibility of signal traces is reduced
Solution Approach 1:
By moving the ESD protection mechanism from the two-dimensional plane to a three-dimensional structure that protrudes vertically, the signal traces can maintain their original planar layouts without being constrained by the presence of ESD components, thus preserving layout flexibility.
Solution Approach 2:
The ESD protection function is extracted from the planar component form and reimagined as a vertical conductive structure. This extraction allows the signal trace layout to remain independent and flexible, as the ESD protection is now provided by a structure that does not interfere with the planar routing decisions.
3Reliability
If additional ESD protection components need to be added, then electrostatic discharge protection coverage is improved, but insufficient area remains for additional components
Solution Approach 1:
The vertical protrusion of the conductive element utilizes the third dimension (height) rather than consuming additional planar area. This allows multiple ESD protection structures to be implemented across the circuit board without each one consuming valuable wiring space, enabling expanded ESD protection coverage.
Solution Approach 2:
The conductive element structure serves multiple functions: it provides ESD protection, maintains electrical connection to ground through the ground plane, and does not interfere with signal trace routing. This multi-functionality allows the same structural approach to be universally applied for additional ESD protection needs without compromising area availability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables effective ESD protection without affecting signal trace layout, enhancing the flexibility of circuit board design by not occupying space for wiring, thus preventing electrical overstress and ensuring the functionality of electronic components.
Implementation Method 1
A static electricity of the at least one signal trace is discharged to the at least one discharging portion
Data Source
AI summary
A circuit board with an electrostatic discharge protection mechanism and an electronic apparatus having the same are provided. The circuit board includes a substrate, at least one signal trace, and a conductive element. The at least one signal trace is disposed on the substrate. The conductive element is electrically connected to a ground plane of the substrate and crosses over the at least one signal trace. The conductive element has at least one discharging portion. The position of the at least one discharging portion corresponds to the at least one signal trace. A gap exists between the at least one discharging portion and the at least one signal trace. A static electricity of the at least one signal trace is discharged to the at least one discharging portion.