Circuit Board Heat Dissipation Fins for Camera Modules
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Solution Overview
Problem
The miniaturization of camera modules in electronic devices leads to compact circuit boards where heat dissipation becomes challenging, affecting the normal operation of electronic components due to high integration density.
Innovation Solution
A circuit board design featuring heat conducting pillars and heat dissipation fins that increase the heat transfer area and air circulation, allowing efficient heat dissipation through a channel formed between the fins, with the pillars made of materials like copper or silver for enhanced efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the circuit board area is reduced to miniaturize the camera module, then the size of the camera module is reduced, but the heat dissipation capability deteriorates due to high integration density
Solution Approach 1:
The patent transitions from two-dimensional heat dissipation (surface level) to three-dimensional heat dissipation by introducing heat dissipation fins that extend vertically from the circuit board surface. This dimensional change increases the heat transfer area without increasing the horizontal footprint of the camera module, thereby maintaining miniaturization while improving heat dissipation capability.
Solution Approach 2:
The patent segments the heat dissipation function into distinct components: heat conducting pillars that vertically segment the heat transfer path from the circuit board to the fins, and heat dissipation fins that segment the surface area into multiple heat exchange elements. This segmentation enables efficient heat distribution and dissipation across the three-dimensional structure.
2Quantity of substance
If electronic components are densely integrated on the circuit board, then the circuit board area is reduced, but heat dissipation becomes difficult
Solution Approach 1:
The patent applies local quality by concentrating heat dissipation resources (heat conducting pillars and fins) specifically in areas where electronic components generate heat. The heat conducting pillars are positioned to conduct heat from high-density component areas, and the fins are arranged to maximize heat exchange in these localized hot zones, thereby addressing heat dissipation challenges without reducing integration density.
3Temperature
If heat dissipation structures are added to the circuit board, then heat dissipation efficiency is improved, but the device complexity increases
Solution Approach 1:
The patent merges the heat dissipation structures (heat conducting pillars and fins) directly with the circuit board substrate, forming an integrated thermal management system. This merging eliminates the need for separate heat dissipation components and simplifies the overall device structure, thereby improving heat dissipation efficiency without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively dissipates heat generated by the camera module components, preventing overheating and ensuring stable operation in compact electronic devices by increasing the heat transfer area and air circulation.
Implementation Method 1
at least one heat conducting pillar (15) is received in one of the at least one through hole (13) and is connected to the first solder mask (11) and the second solder mask (12)
Implementation Method 2
The plurality of heat dissipation fins (20) are arranged on a surface of the first solder mask (11) facing away from the second solder mask (12) for releasing the heat of the circuit board (100)
Data Source
AI summary
A circuit board includes a circuit substrate, a first solder mask, and a plurality of heat dissipation fins. The circuit substrate includes a first surface. The first solder mask is arranged on the first surface. The plurality of heat dissipation fins are arranged on a surface of the first solder mask facing away from the first surface. A heat dissipation channel is formed between any two adjacent of the plurality of heat dissipation fins. A camera assembly having the circuit board and an electronic device having the circuit board are also provided.