Circuit Board Fixing Mechanism With Adjustable Level Difference Structure
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Solution Overview
Problem
Conventional fixing mechanisms for circuit boards are not adaptable to boards of varying thickness, requiring redesign of casings and increasing manufacturing costs, as they fail to accurately align connectors with openings due to thickness variations.
Innovation Solution
A fixing mechanism featuring a casing with a positioning component having a level difference structure with multiple support surfaces, allowing the connector to align with openings regardless of board thickness, utilizing a detachable or adjustable annular body system to accommodate different thicknesses without replacing mechanical components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the casing is redesigned with a small boss or adjusted opening position to accommodate different thickness circuit boards, then the connector can align with the opening, but the manufacturing cost increases and the original thickness circuit board cannot apply to the redesigned casing
Solution Approach 1:
The positioning component includes a movable annular body that can adjust its vertical position relative to the first annular body. This dynamic adjustment mechanism allows the positioning component to adapt to different circuit board thicknesses by changing the height of the level difference structure, thereby maintaining accurate alignment without requiring casing redesign. The movable annular body can be positioned at different heights to accommodate varying board thicknesses while keeping the connector aligned with the opening.
Solution Approach 2:
The invention changes the parameter of the positioning component's height by making the annular body movable. This allows the level difference structure to have different heights corresponding to different circuit board thicknesses. By adjusting the vertical position parameter of the annular body, the system can accommodate various board thicknesses while maintaining consistent alignment, thus resolving the contradiction between alignment precision and adaptability.
2Ease of manufacture
If a conventional fixing mechanism is used without thickness adaptation, then the manufacturing cost is low, but the connector cannot accurately align with the opening due to thickness variation
Solution Approach 1:
The positioning component is designed with a universal structure that can handle multiple circuit board thicknesses using the same basic components. The movable annular body can be positioned at different heights to accommodate various thicknesses, making the single positioning component adaptable to different board thicknesses without requiring multiple specialized components or casing redesigns. This maintains low manufacturing cost while achieving accurate alignment.
3Device complexity
If the positioning component uses a fixed structure, then the device complexity is low, but it cannot accommodate circuit boards with varying thickness
Solution Approach 1:
The positioning component is segmented into two separate annular bodies: a first annular body with a first support surface and a movable second annular body with a second support surface. This segmentation allows the second annular body to move independently relative to the first, enabling adjustment of the level difference structure's height. The segmented design provides adaptability to different thicknesses while keeping the overall structure relatively simple and easy to manufacture.
Data Source
AI summary
A fixing mechanism includes a casing and a positioning component. The casing includes a base and at least one wall whereon an opening is formed. A bottom of the positioning component is disposed on the base, and a top of the positioning component includes a level difference structure, which includes a first support surface and a second support surface. The first support surface is formed on an inner of the level difference structure, and the second support surface surrounds the first support surface to form on an outer of the level difference structure. The first support surface is higher than the second support surface relative to the base. The positioning component contacts the circuit board via the first support surface or the second support surface according to a hole on the circuit board, so as to align a connector of the circuit board with the opening on the casing.