Circuit Board Flatness via High Modulus Dielectric Layer
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Solution Overview
Problem
Circuit boards face challenges in maintaining flatness under external pressure and temperature variations, leading to potential warping and damage to components, and issues with light leakage and mixing of light emissions from multiple light emitting devices.
Innovation Solution
A circuit board design featuring a base plate with a first circuit layer embedded in a dielectric layer of higher Young's modulus, exposed through openings, and a spacer to prevent conductive contact collision, along with a light absorbing structure to manage light emission, ensuring flatness and preventing light leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a conventional dielectric layer is used on the base plate, then the circuit board can be manufactured with standard materials, but the circuit board warps under external pressure and temperature variations
Solution Approach 1:
The patent changes the physical parameter of the dielectric layer by doping it with inorganic materials (such as SiO2, Al2O3) to increase its Young's modulus. This parameter change enables the dielectric layer to maintain higher rigidity and resist warping under external pressure and temperature variations, directly resolving the flatness stability issue.
Solution Approach 2:
The patent creates a composite dielectric layer by combining organic dielectric material with inorganic materials through doping. This composite structure leverages the advantages of both materials: the organic component provides dielectric properties while the inorganic component enhances mechanical strength and dimensional stability, preventing warping under environmental stress.
2Adaptability or versatility
If light emitting elements are densely arranged on the circuit board, then the device functionality is improved, but light leakage and mixing between adjacent elements occurs
Solution Approach 1:
The patent extracts and removes the harmful light emissions that leak from light emitting elements by introducing a light absorbing layer. This layer selectively absorbs the harmful light before it can spread to adjacent elements, eliminating the light mixing problem while allowing dense arrangement of light emitting elements for improved device functionality.
3Ease of manufacture
If the dielectric layer is made softer for easier manufacturing, then the embedding process is simplified, but the layer wraps and causes component positioning errors
Solution Approach 1:
The patent changes the mechanical parameter of the dielectric layer by increasing its Young's modulus through inorganic doping. This makes the dielectric layer sufficiently rigid to maintain its shape during manufacturing, preventing wrapping that would cause positioning errors, while still allowing the embedding process to proceed effectively.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design maintains the circuit board's flatness under external conditions, prevents component damage, and effectively manages light emission to avoid leakage and mixing, improving yield and device functionality.
Implementation Method 1
A Young's modulus of the first dielectric layer is greater than a Young's modulus of the base plate
Implementation Method 2
a light absorbing structure to manage light emission, ensuring flatness and preventing light leakage
Data Source
AI summary
A circuit board includes a base plate, a first circuit layer, a first dielectric layer, and a light emitting element. The first circuit layer is disposed on the base plate. The first dielectric layer is disposed on the base plate and has plural openings. The first circuit layer is embedded in the first dielectric layer and exposes the openings. A Young's modulus of the first dielectric layer is greater than a Young's modulus of the base plate. The light emitting element is electrically connected to the first circuit layer through the openings.