Circuit Board Unit with Gap Retention for Cartridge Stress Relief
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Solution Overview
Problem
The existing technology for attaching a circuit board to a cartridge subjects the board to stress during thermal caulking, leading to deformation and potential detachment of electronic components like memory and terminals.
Innovation Solution
A circuit board unit is designed with a first and second member where the circuit board is retained between them with gaps, avoiding direct fixation and reducing stress, and a method of manufacturing this unit involves bonding the second member to a region different from the one opposing the circuit board, ensuring the board is not fixed to either member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the circuit board is fixed to the circuit board attaching member through thermal caulking, then the circuit board is securely attached to the cartridge, but the joint receives stress that deteriorates the circuit board and electronic components
Solution Approach 1:
A resin layer is introduced as an intermediary between the circuit board and the circuit board attaching member. The resin layer absorbs and distributes stress, preventing direct stress concentration at the thermal caulking joint. This mediator protects the circuit board and electronic components from deterioration while maintaining secure attachment.
Solution Approach 2:
The invention changes the physical and chemical parameters of the bonding interface by using a resin layer with specific viscosity, curing characteristics, and mechanical properties. The resin's ability to flow and bond creates a more compliant interface that reduces stress transmission to the circuit board, thereby improving reliability without sacrificing attachment strength.
2Reliability
If the circuit board is retained between the first member and second member with gaps, then stress on the circuit board is minimized, but the assembly complexity increases
Solution Approach 1:
The circuit board attaching member is divided into multiple functional regions: a first member that provides structural support, a second member that provides bonding surface, and gaps that provide stress relief. This segmentation allows each region to perform its specific function optimally while collectively reducing overall assembly complexity compared to a monolithic design.
Solution Approach 2:
Instead of fixing the circuit board directly to a solid attaching member, the invention inverts the approach by retaining the circuit board with gaps on both sides. This inversion transforms the attaching member from a rigid fixed structure to a flexible retaining structure that accommodates thermal expansion and stress without direct rigid contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design minimizes stress on the circuit board and electronic components, preventing deformation and detachment, while allowing for efficient assembly and attachment to a cartridge, thereby enhancing the reliability and longevity of the components.
Implementation Method 1
bonding a second member to a region of the surface
Data Source
AI summary
A circuit board unit which is attached to the cartridge includes a circuit board on which an electronic component is mounted, a first member having a surface opposing the circuit board, and a second member which is bonded to a region of the surface of the first member which region is different from the region of the surface opposing the circuit board. The circuit board is not fixed to the first member and the second member and is retained between the first member and the second member with gaps extending in an orthogonal direction orthogonal to the surface and in a surface direction in parallel to the surface.