Multi-layer Circuit Board Embedded Heat Conducting Block
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Solution Overview
Problem
The existing methods for embedding a metal substrate in circuit boards for heat dissipation are complex and inefficient, requiring separate assembly procedures that affect production efficiency.
Innovation Solution
A method of embedding a heat conducting block within a multi-layer circuit board by opening slot segments on daughter boards, stacking them with medium layers, and pressing them together to form a receiving slot, thereby simplifying the assembly process and enhancing heat dissipation capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal substrate is partially embedded in a circuit board for heat dissipation, then heat dissipation capability is improved, but the assembly process becomes more complex and production efficiency decreases
Solution Approach 1:
The patent applies preliminary action by pre-forming recesses in the substrate layer before assembling the circuit board layers. The heat dissipation components are positioned in these pre-formed recesses, allowing them to be automatically embedded during the lamination process rather than requiring separate assembly operations. This eliminates the need for assistant technical assembly and simplifies the overall manufacturing process.
Solution Approach 2:
The patent merges the heat dissipation component assembly with the circuit board lamination process. By integrating the heat dissipation components into the substrate layer before stacking the circuit board layers, the embedding of heat dissipation components and the lamination process are combined into a single manufacturing step, thereby improving production efficiency and reducing process complexity.
2Temperature
If a metal substrate is partially embedded in a circuit board for heat dissipation, then heat dissipation capability is improved, but production efficiency decreases due to additional assembly steps
Solution Approach 1:
The patent applies preliminary action by pre-forming recesses in the substrate layer before assembling the circuit board layers. The heat dissipation components are positioned in these pre-formed recesses, allowing them to be automatically embedded during the lamination process rather than requiring separate assembly operations. This eliminates the need for assistant technical assembly and simplifies the overall manufacturing process.
Solution Approach 2:
The patent merges the heat dissipation component assembly with the circuit board lamination process. By integrating the heat dissipation components into the substrate layer before stacking the circuit board layers, the embedding of heat dissipation components and the lamination process are combined into a single manufacturing step, thereby improving production efficiency and reducing process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the assembly of the heat conducting block and increases production efficiency while effectively reducing heat resistance and enhancing local heat dissipation by embedding the heat conducting block during the pressing process, ensuring efficient heat transfer from electronic components.
Implementation Method 1
a heat conducting block (7), and a plurality of daughter boards (2) and medium layers (3) that are stacked together
Data Source
Figure 1~2
Figure 3
Figure 4~6
AI summary
A multi-layer circuit board, a method of manufacturing the same, and a communication device are provided. As for the multi-layer circuit board, a slot segment is opened on at least one daughter board to form a first daughter board. At least one daughter board and medium layers are stacked together. The daughter boards include first daughter boards. The first daughter boards are placed in such a way that the slot segments of the first daughter boards are communicated. The slot segments are communicated to form a receiving slot. A heat conducting block is placed within the receiving slot. Each medium layer is sandwiched between the daughter boards. The stacked daughter boards, medium layers, and heat conducting block are pressed together, and the pressed daughter boards and heat conducting block are made into a multi-layer circuit board. The heat conducting block is embedded when the circuit board is pressed, thereby simplifying the assembling process of the heat conducting block.