Circuit Board Dual-Sided Heat Dissipation for Dust and Airflow
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Solution Overview
Problem
Existing heat dissipation systems face issues with serious dust accumulation and poor temperature uniformity due to varying heat generation component temperatures across the circuit board.
Innovation Solution
A working assembly with a first and second heat dissipator, where the second heat dissipator is larger and longer than the first, featuring fewer or differently arranged heat dissipation fins to mitigate dust accumulation and increase ventilation, thereby improving heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipator with many heat dissipation fins is used, then heat dissipation efficiency is improved, but dust accumulation increases
Solution Approach 1:
The patent applies local quality by providing different heat dissipator configurations at different locations on the circuit board. The first heat dissipator has fewer and shorter fins suited for its location, while the second heat dissipator has more and taller fins for its location, optimizing both heat dissipation and dust resistance at each specific position
Solution Approach 2:
The patent segments the heat dissipation function into multiple independent heat dissipators (first and second heat dissipators) located at different positions on the circuit board, each with customized fin configurations tailored to their specific thermal and environmental requirements
2Temperature
If heat dissipation fins are made taller and denser, then heat dissipation surface area increases, but ventilation capability decreases
Solution Approach 1:
The patent implements local quality by varying the fin density and height at different locations. The second heat dissipator has higher and denser fins where enhanced heat dissipation is needed, while the first heat dissipator has lower and sparser fins where ventilation is more critical, thus optimizing both heat dissipation surface area and ventilation capability simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces dust accumulation and enhances ventilation, leading to improved heat dissipation and temperature uniformity across the circuit board components.
Implementation Method 1
a first heat dissipator provided on a first surface of the circuit board and corresponding to the heat generation components; and a second heat dissipator provided on a second surface of the circuit board
Implementation Method 2
working assembly and electronic device... adapted to work in a heat dissipation duct, a direction from an air inlet to an air outlet of the heat dissipation duct being a first direction
Data Source
AI summary
A working assembly and an electronic device. The working assembly comprises: a circuit board, the circuit board being provided with a plurality of heating components; a first heat dissipator, provided on a first surface of the circuit board and corresponding to the heating components; and a second heat dissipator, provided on a second surface of the circuit board, the size of the second heat dissipator being greater than the size of the first heat dissipator. The problem of serious dust accumulation in the first heat dissipator can be mitigated, and the ventilation amount of the first heat dissipator is increased, thereby improving the heat dissipation effect.