Layered Circuit Board Heat Dissipation With Copper Isolation Paths
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Solution Overview
Problem
Circuit boards face reduced safety performance and shortened service life due to inadequate heat dissipation from electronic components, which existing technologies fail to address effectively.
Innovation Solution
A method for manufacturing a circuit board involving a thermoelectric separation metal layer with alternating copper and thermoelectric separation metal heat conducting portions and members, along with insulating layers and channels, to enhance heat dissipation while reducing production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional single-material heat dissipation structures are used, then manufacturing simplicity is maintained, but heat dissipation efficiency is insufficient
Solution Approach 1:
The patent employs a composite heat dissipation structure combining copper heat conducting portions with thermoelectric separation metal portions. The copper layers provide high thermal conductivity for efficient heat transfer, while the thermoelectric separation metal layers provide electrical isolation. This composite material approach resolves the contradiction by achieving superior heat dissipation efficiency through material properties while maintaining a relatively simple layered manufacturing process.
Solution Approach 2:
The heat dissipation structure is segmented into alternating copper and thermoelectric separation metal portions arranged in a multi-layer configuration. Each layer serves a specific function: copper layers for heat conduction and thermoelectric layers for electrical isolation. This segmentation allows the system to optimize heat dissipation performance while keeping the manufacturing process manageable through standardized layer-by-layer construction.
2Temperature
If heat dissipation performance is improved through complex structures, then temperature control is enhanced, but production cost increases
Solution Approach 1:
The alternating copper and thermoelectric separation metal structure serves multiple functions simultaneously: copper provides thermal conduction pathways while thermoelectric separation metal provides both electrical isolation and structural support. This multi-functionality reduces the need for additional dedicated components, thereby improving heat dissipation performance without proportionally increasing production complexity and cost.
Solution Approach 2:
The patent merges the heat conduction function (copper) with the electrical isolation function (thermoelectric separation metal) into a single integrated layered structure. By combining these functions in alternating layers, the design achieves effective temperature control while avoiding the need for separate heat dissipation and insulation components, thus controlling production costs.
3Power
If electronic components generate heat during operation, then functional performance is maintained, but safety performance and service life are compromised
Solution Approach 1:
The patent converts the harmful heat generated by electronic components into a manageable thermal flow by providing dedicated copper heat conducting portions that actively channel heat away from sensitive areas. The thermoelectric separation metal portions simultaneously prevent electrical interference. This approach transforms the harmful thermal effect into a controlled heat transfer process, maintaining functional performance while significantly improving safety and reliability.
Solution Approach 2:
The copper and thermoelectric separation metal layers act as intermediary heat transfer mediators between the electronic components and the heat dissipation pathways. These intermediate structures facilitate controlled heat removal while providing electrical isolation, thereby protecting the circuit board from both thermal and electrical stress, enhancing safety performance and service life.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat generated by electronic components, improving the safety performance and service life of circuit boards while minimizing production costs through efficient heat transfer mechanisms.
Implementation Method 1
a first heat conducting portion and a first heat conducting member are formed on the first metal layer... a second heat conducting portion, a second heat conducting member, and a first heat conducting channel are respectively formed in the first blind hole, the first blind groove, and the through hole
Data Source
AI summary
A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The method includes providing a first metal layer defining a first slot; forming a first adhesive layer in the first slot; electroplating copper on each first pillar to form a first heat conducting portion; forming a first insulating layer on the first adhesive layer having the first heat conducting portion, and defining a first blind hole in the first insulating layer; filling the first blind hole with thermoelectric separation metal to form a second heat conducting portion; forming a first wiring layer on the first insulating layer; forming a second insulating layer on the first wiring layer, defining a second blind hole on the second insulating layer; electroplating copper in the second blind hole to form a third heat conducting portion; mounting an electronic component on the second insulating layer.