Circuit Board Heat Storage Layout for Power Module Temperature Spikes
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Solution Overview
Problem
Conventional power semiconductor devices face challenges in effectively dissipating sudden increases in heat, leading to overheating and reduced reliability due to limited heat dissipation capabilities, especially in high-power or high-loss electronic components.
Innovation Solution
Incorporating a heat storage portion with high specific heat capacity into the circuit board, positioned close to the electronic component, to temporarily store and release heat, thereby reducing temperature spikes and improving heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the heat dissipation path uses conventional conducting layer and heat conducting layer, then heat can be transferred to the heat dissipation apparatus, but when heat suddenly increases in a short time, the heat dissipation capability is limited and temperature increases sharply
Solution Approach 1:
The patent introduces a heat storage layer with high specific heat capacity between the conducting layer and heat conducting layer, which preliminarily stores heat when heat suddenly increases, preventing sharp temperature rises before heat is gradually dissipated to the heat dissipation apparatus
Solution Approach 2:
The patent changes the thermal parameters of the circuit board by adding a heat storage layer with high specific heat capacity, transforming the heat dissipation system from direct conduction to a two-stage process of heat storage followed by heat release, thereby improving temperature control
2Power
If the size of power semiconductor device decreases and density of internal component increases, then power requirement is met, but heat dissipation problem greatly affects efficiency improvement
Solution Approach 1:
The patent embeds the heat storage layer within the circuit board structure, nesting it between the conducting layer and heat conducting layer, thereby adding heat storage functionality without significantly increasing the overall device size or reducing component density
Solution Approach 2:
The patent creates a composite heat management structure by combining materials with different thermal properties - the heat storage layer with high specific heat capacity is integrated with the conducting layer and heat conducting layer, forming a multi-layer composite structure that simultaneously achieves heat storage and heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat storage portion effectively manages sudden heat surges, preventing component damage and enhancing the reliability and service life of the packaged device by quickly storing and dissipating heat.
Implementation Method 1
the heat storage portion has a relatively high specific heat capacity and has functions of temporarily storing heat and releasing heat
Implementation Method 2
Heat generated by the electronic component 2' during working is transferred to the heat dissipation apparatus 200' via the conducting layer 11', the insulating substrate 12', and the heat conducting layer 13'
Data Source
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AI summary
This application provides a packaged device, where the packaged device includes a circuit board, an electronic component, and a heat storage portion. The electronic component is electrically connected to the circuit board; and the heat storage portion is disposed on the circuit board or embedded in the circuit board, and the heat storage portion is adjacent to the electronic component, where a specific heat capacity of the heat storage portion is higher than a specific heat capacity of the circuit board, and the heat storage portion is configured to store and release heat. This application further provides a packaged module and a power conversion device to which the packaged device is applied. A heat storage material with a relatively high specific heat capacity is introduced into the packaged device, and the heat storage portion is disposed on the circuit board around the electronic component, so that a large amount of heat generated by the electronic component in a short time can be quickly stored in the heat storage portion and then released to the outside, thereby reducing a risk of damage to the electronic component and improving reliability of the packaged device.