Circuit Board Assembly With Thermal Expansion Heat Switch
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Solution Overview
Problem
Conventional circuit board assemblies require complex temperature controlling systems to turn on or off heat dissipation assemblies based on chip temperature, leading to additional power consumption and reduced lifespan.
Innovation Solution
A circuit board assembly with a temperature switch structure using a first and second metal layer with different thermal expansion coefficients, allowing the structure to deform and control the heat dissipation assembly's operation without a temperature sensor or complex control system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a temperature controlling system with temperature sensor and complex control system is used to turn on or off the heat dissipation assembly, then the heat dissipation assembly can be controlled based on chip temperature, but the device complexity increases
Solution Approach 1:
The temperature switch structure utilizes the thermal expansion difference between the first metal layer and second metal layer to automatically detect temperature changes and control the heat dissipation assembly without requiring external sensors or control systems. The structure serves itself by converting thermal energy directly into mechanical switching action.
Solution Approach 2:
The patent employs two metal layers with different thermal expansion coefficients that expand at different rates when exposed to heat from the chip. This differential expansion causes the layers to bend or deform, mechanically opening or closing the electrical circuit to the heat dissipation assembly based on temperature conditions.
2Temperature
If the heat dissipation assembly is always electrically connected to the circuit board, then the chip can be cooled continuously, but the power consumption increases and lifespan is reduced
Solution Approach 1:
The electrical connection between the heat dissipation assembly and circuit board is made dynamic rather than static. The temperature switch structure automatically adjusts the connection state based on real-time temperature conditions, switching the heat dissipation assembly on when cooling is needed and off when it is not, thereby optimizing power consumption.
Solution Approach 2:
The system automatically monitors temperature and controls the heat dissipation assembly without external intervention. The temperature switch structure detects temperature changes and autonomously switches the electrical connection, eliminating the need for continuous power consumption associated with active temperature sensing and control systems.
3Temperature
If the heat dissipation assembly is always electrically connected to the circuit board, then the chip can be cooled continuously, but the lifespan of the heat dissipation assembly is reduced
Solution Approach 1:
The electrical connection is made dynamic through the temperature switch structure, allowing the heat dissipation assembly to operate only when thermally required. This intermittent operation based on actual temperature conditions reduces cumulative wear and extends the operational lifespan of the heat dissipation assembly.
4Device complexity
If a temperature switch structure with different thermal expansion coefficients is used, then the heat dissipation assembly can be controlled simply, but the manufacturing precision requirements increase
Solution Approach 1:
The patent changes the material parameters of the metal layers by selecting materials with significantly different thermal expansion coefficients. This material parameter selection enables the temperature switch function while allowing for standard manufacturing tolerances, as the strong differential expansion effect compensates for minor variations in layer thickness or stacking precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient on/off control of the heat dissipation assembly based on chip temperature, reducing power consumption and extending the lifespan of the heat dissipation assembly while eliminating the need for complex control systems.
Implementation Method 1
A thermal expansion coefficient of the first metal layer is different from a thermal expansion coefficient of the second metal layer so that the temperature switch structure is deformed in response to a temperature change of the embedded chip
Data Source
AI summary
This disclosure provides a circuit board assembly and a manufacturing method thereof. The circuit board assembly includes circuit board, embedded chip, heat dissipation assembly and temperature switch structure. The temperature switch structure includes a first metal layer and a second metal layer stacked on each other. The first metal layer of the temperature switch structure is electrically connected to the circuit board and is thermally coupled to the embedded chip. A thermal expansion coefficient of the first metal layer is different from a thermal expansion coefficient of the second metal layer so that the temperature switch structure is deformed in response to a temperature change of the embedded chip to be in contact with or spaced apart from the second electrically conductive contact of the heat dissipation assembly.