Additive Circuit Board Assembly With Single-Step Heating Press
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Solution Overview
Problem
In the additive manufacturing of circuit boards, heat generation during various manufacturing steps leads to thermal stress, necessitating a reduction in the number of heating steps to protect the board.
Innovation Solution
A method and device for manufacturing circuit boards that involve laminating and shaping the board on a peeling member, attaching a metal paste to the wiring, arranging electronic components, and using a heating press to collectively heat the peeling member and metal paste while pressing the board to correct warpage, thereby reducing the number of heating steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple heating steps are used in additive manufacturing of circuit boards, then the peeling member can be released and metal paste can be cured, but thermal stress accumulates and damages the circuit board
Solution Approach 1:
The patent combines the heating of the peeling member and the curing of metal paste into a single heating step. The heating device simultaneously performs both functions by heating the circuit board to a temperature that enables peeling member release while also curing the metal paste, thereby reducing thermal stress accumulation and improving circuit board quality
Solution Approach 2:
The patent optimizes the heating temperature and time parameters to achieve both peeling member release and metal paste curing in one step. By carefully controlling the heating parameters within a specific range, the process ensures that the peeling member can be released while the metal paste is properly cured, resolving the contradiction between reliability and thermal stress
2Reliability
If multiple heating steps are performed, then complete curing and release can be achieved, but production efficiency decreases due to increased process time
Solution Approach 1:
The patent merges multiple heating steps into a single heating operation that simultaneously achieves peeling member release and metal paste curing. This consolidation reduces the total process time while ensuring complete curing through optimized heating parameters, thereby improving production efficiency without sacrificing reliability
Solution Approach 2:
The patent implements continuous heating throughout the process, maintaining optimal temperature to simultaneously achieve peeling member release and metal paste curing without interruption. This continuous useful action eliminates idle time between separate heating steps, enhancing productivity while ensuring complete curing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the influence of thermal stress on the circuit board by combining two heating steps into one, improving the quality of the board, increasing production efficiency, and lowering manufacturing costs.
Implementation Method 1
heat is generated in various manufacturing steps. In order to protect a board to be manufactured from thermal stress caused by heating
Implementation Method 2
pressing the circuit board with the base member and the press member to correct warpage of the circuit board
Implementation Method 3
the metal paste is arranged between the electronic component and the wiring, and is cured by being heated to electrically connect the electronic component and the wiring
Data Source
AI summary
In a method for manufacturing a circuit board according to an additive manufacturing shaping method, a circuit board manufacturing method and a circuit board manufacturing device that can reduce the influence of thermal stress on a circuit board by reducing the number of heating steps are provided. A circuit board manufacturing method according to the present disclosure includes a board shaping step of laminating and shaping a circuit board having a wiring on a peeling member adhered to a base member, an attachment step of attaching a metal paste contacting the wiring to the circuit board, an electronic component arrangement step of arranging an electronic component on the circuit board to arrange the electronic component and the wiring via the metal paste, and a heating press step of arranging a press member above the circuit board, and causing the peeling member to be easily released from the base member and curing the metal paste by collectively heating the peeling member and the metal paste while pressing the circuit board with the base member and the press member to correct warpage of the circuit board.