Multi-Layer Circuit Board Layout for Imaging Noise Reduction
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Solution Overview
Problem
Existing technologies fail to effectively reduce both hot carrier light emission and inductive noise in solid-state imaging devices, such as CMOS image sensors, which degrade signal quality.
Innovation Solution
A circuit board design featuring multiple conductor layers with specific patterns and configurations, including planar, mesh, and linear patterns, where the repeating cycles of the patterns are synchronized to minimize the magnetic flux and hot carrier light emission, thereby reducing noise in signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a light blocking structure is formed with wiring lines between active elements and photoelectric conversion portions, then hot carrier light emission is reduced, but inductive noise from conductor loops remains
Solution Approach 1:
The light blocking structure is divided into multiple separate conductor layers (first conductor layer with first pattern, second conductor layer with second pattern, third conductor layer with third pattern) rather than using a single continuous wiring structure. This segmentation allows each layer to be optimized for different functions: light blocking and inductive noise reduction.
Solution Approach 2:
Multiple conductor layers are stacked in a nested configuration where the first conductor layer, second conductor layer, and third conductor layer are positioned at different heights (Z-axis directions) relative to each other. This nested structure enables simultaneous light blocking by the first layer and inductive noise cancellation through the combined effect of all layers.
2Object-generated harmful factors
If a two-layered mesh wiring line is used to cancel magnetic flux, then inductive noise is reduced, but hot carrier light emission blocking is not achieved
Solution Approach 1:
The patent merges two previously separate solutions into a single integrated structure: the light blocking function (using dense wiring patterns between active elements and photoelectric conversion portions) and the inductive noise cancellation function (using multi-layered mesh patterns with synchronized repeating cycles). The first, second, and third conductor layers work together to simultaneously achieve both objectives.
Solution Approach 2:
The multi-layered conductor structure serves multiple functions: the first conductor layer provides primary light blocking, while the combination of first, second, and third conductor layers with synchronized repeating cycles provides inductive noise reduction. This universal structure replaces the need for separate light blocking structures and noise cancellation wiring.
3Object-affected harmful factors
If conductor layers with synchronized repeating cycles are used, then both light blocking and inductive noise reduction are achieved, but device complexity increases
Solution Approach 1:
Different conductor layers are positioned in specific local regions with optimized patterns: the first conductor layer is positioned closer to the photoelectric conversion portions for light blocking, while the second and third conductor layers are positioned to optimize magnetic flux cancellation. Each layer has locally optimized pattern characteristics (mesh, linear, or planar) suited to its specific functional requirements.
Solution Approach 2:
The patent utilizes the Z-axis dimension (vertical stacking) to arrange multiple conductor layers at different heights, transforming a two-dimensional wiring problem into a three-dimensional structure. This dimensional expansion allows simultaneous optimization of light blocking (horizontal arrangement) and inductive noise reduction (vertical stacking with synchronized patterns) without excessive planar complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces inductive noise and hot carrier light emission, leading to improved signal quality and image clarity by orthogonalizing magnetic flux directions and blocking light emission effectively.
Implementation Method 1
a magnetic flux passing through the conductor loop is generated by a change in the current flowing in the wiring line, which might cause an induced electromotive force in the conductor loop and generate inductive noise in a pixel signal
Implementation Method 2
some active elements such as transistors and diodes existing in the solid-state imaging device cause minute hot carrier light emission. In a case where this hot carrier light emission leaks into the photoelectric conversion portions formed in the pixels, noise is generated in the pixel signals
Data Source
AI summary
The present technology relates to a circuit board, a semiconductor device, and an electronic apparatus that reduce the generation of noise signals. A circuit board includes: a first conductor layer that has a first conductor portion including a conductor having a planar or mesh-like first basic pattern repeatedly disposed in the same plane; and a second conductor layer that has a second conductor portion including a conductor having a planar or mesh-like second basic pattern repeatedly disposed in the same plane, and a third conductor portion including a conductor having a planar, linear, or mesh-shaped third basic pattern repeatedly disposed in the same plane. The repeating cycles of the first and second basic patterns are substantially the same cycles, and the third basic pattern is different than the second basic pattern. The present technology can be applied to a circuit board of a semiconductor device and the like, for example.