Circuit Board Inlay Mount Pad for Heat Dissipation and Current Flow
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Solution Overview
Problem
Conventional circuit structures fail to allow large currents to flow between electronic components and conductive patterns on circuit boards without relying on inlay components, limiting heat dissipation and connectivity.
Innovation Solution
A circuit board design featuring through holes with inlay members and exposed conductive patterns allows direct connection of electronic components to the board, enabling heat transfer and current flow through press-fitting and solder connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If an inlay component is press-fit into a press-fit hole to improve heat dissipation, then heat dissipation is improved, but current cannot flow between the electronic component and the conductive pattern without passing through the inlay component
Solution Approach 1:
The mount pad is segmented into two distinct parts: a first mount pad formed by the end surface of the inlay member for heat dissipation, and a second mount pad formed by the exposed conductive pattern for current connectivity. This segmentation allows each part to fulfill its specific function independently, resolving the contradiction between heat dissipation and current flow paths.
Solution Approach 2:
The resist pattern acts as an intermediary element that defines the boundary between the first and second mount pads. By strategically placing the resist to expose specific conductive patterns while covering others, it mediates between the heat dissipation function (inlay component) and the current connectivity function (conductive pattern), enabling both functions to coexist without interference.
2Temperature
If a terminal of an electronic component is connected to the inlay component, then heat dissipation is improved, but a large current is not allowed to flow between the electronic component and the conductive pattern
Solution Approach 1:
The mount pad is segmented into two distinct parts: a first mount pad formed by the end surface of the inlay member for heat dissipation, and a second mount pad formed by the exposed conductive pattern for current connectivity. This segmentation allows each part to fulfill its specific function independently, resolving the contradiction between heat dissipation and current flow paths.
Solution Approach 2:
The circuit board structure achieves multi-functionality by enabling the same mounting area to serve dual purposes: the inlay component provides heat dissipation while the exposed conductive pattern simultaneously provides high-capacity current flow path. This universal design allows the mount pad to handle both thermal and electrical requirements without compromise.
3Object-affected harmful factors
If the conductive pattern is completely covered with resist for insulation, then electrical insulation is improved, but current connectivity to the conductive pattern is lost
Solution Approach 1:
The resist coverage is applied with local quality variation: certain areas of the conductive pattern are covered with resist for insulation, while specific portions are deliberately exposed to create the second mount pad for current connectivity. This selective local quality approach ensures that insulation is provided where needed while maintaining current flow paths where required.
Solution Approach 2:
The mount pad is segmented into two distinct parts: a first mount pad formed by the end surface of the inlay member for heat dissipation, and a second mount pad formed by the exposed conductive pattern for current connectivity. This segmentation allows each part to fulfill its specific function independently, resolving the contradiction between heat dissipation and current flow paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation and improves current connectivity between electronic components and the circuit board, reducing solder defects and ensuring reliable current paths.
Implementation Method 1
transfer heat from an electronic component mounted on a circuit board to an end surface of an inlay member
Implementation Method 2
allow a current to flow from the electronic component to a conductive pattern on the circuit board
Data Source
AI summary
A circuit board includes a circuit board main body including a first through hole, and a first inlay member inserted into the first through hole. The first inlay member includes a first end surface, one surface of the circuit board main body includes a first through hole peripheral portion located around the first through hole, a first conductive pattern is located around the first through hole peripheral portion, the first through hole peripheral portion includes a first pattern exposed area where the first conductive pattern is exposed, and a first pattern non-exposed area where the first conductive pattern is covered with a resist, and the first end surface and the first pattern exposed area are a first mount pad to which a first terminal of an electronic component is connected.