Circuit Board Inspection Height Data via Overlapped Image Matching
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Solution Overview
Problem
Conventional circuit board inspection apparatuses using multiple cameras face challenges in accurately matching and combining images from different areas, leading to unreliable height measurements when the measurement object is split between cameras.
Innovation Solution
A method that involves capturing images of partially overlapping areas using grid patterned light, matching the images based on overlapped regions, and generating combined height information by aligning and combining the images using relative positional relationships obtained from the matching process, which includes selecting feature dots and using equations to determine the positional relationship between the images.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If two cameras are used to capture images of different areas to improve inspection speed and resolution, then inspection efficiency is improved, but measurement credibility deteriorates when exact combination of captured images fails
Solution Approach 1:
The patent introduces an intermediary matching process that uses overlapped areas between adjacent fields of view as a mediator to align multiple camera images. By identifying corresponding features in the overlapped regions and calculating transformation parameters, the system creates a reliable reference framework that enables accurate combination of images from multiple cameras, thus maintaining measurement credibility while preserving the productivity benefits of multi-camera inspection
2Productivity
If two cameras are used to capture images of different areas to improve inspection speed and resolution, then inspection efficiency is improved, but image matching accuracy deteriorates
Solution Approach 1:
The patent applies preliminary action by performing image matching and calculating transformation parameters before final measurement processing. The system pre-processes the images by identifying features in overlapped areas, establishing coordinate transformations, and creating a unified reference framework in advance. This preliminary matching ensures that when measurements are taken from combined images, the spatial relationships are already accurately established, thereby maintaining high measurement precision despite using multiple cameras for faster inspection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures precise matching and accurate height information with high resolution and speed, leveraging the benefits of multiple camera usage by compensating for inferior image credibility and enhancing inspection efficiency.
Implementation Method 1
irradiating a measurement object formed on a circuit board with grid patterned light; capturing and obtaining a first gird image corresponding to a first area and a second grid image corresponding to a second area
Data Source
AI summary
A method of generating height information in a circuit board inspection apparatus, first, obtaining a first image corresponding to a first area and a second image corresponding to a second area with partially overlapped to the first area of a test board. Next, the first image and the second image are matched based on the overlapped area of the first and second area. Sequentially, a relative positional relationship of the first and second images is obtained from the result of matching. Sequentially, a combined grid image is generated by combining the first grid image and the second grid image based on the relative positioning relationship, wherein the first and second grid images are obtained by irradiating a grid patterned light toward a measurement object formed on the board inspection apparatus. Therefore, it is possible to generate an exact height information.