Circuit Board Insulating Pad for Solder Deposition Control
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Solution Overview
Problem
The miniaturization of electronic products and the use of fine-pitch electronic components on circuit boards during surface mount technology (SMT) lead to difficulties in controlling the amount of solder, resulting in insufficient solder during the through hole standard package process, causing missing solder issues with dual inline package (DIP) components.
Innovation Solution
A circuit board design that includes a conductive ring, solder mask, and insulating pads to increase the space for solder deposition, allowing for a thicker solder layer and reducing the likelihood of missing solder by positioning the insulating pads to elevate the solder coating tool and create a larger space for solder containment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a steel plate is used for printing solder during surface mount technology, then the solder amount can be controlled, but the thickness of the steel plate must be reduced to accommodate fine pitch components, which causes insufficient solder for through hole standard package technologies
Solution Approach 1:
The patent applies local quality by creating different solder deposition zones on the circuit board surface. Insulating pads are placed selectively around through hole openings to create localized areas with different solder accumulation characteristics. This allows fine pitch components to receive appropriate solder amounts while through hole components receive additional solder in their designated zones, resolving the contradiction between solder control precision and solder sufficiency.
Solution Approach 2:
The insulating pads serve as intermediary elements between the steel plate and the solder mask. These pads modify the solder flow and accumulation pattern by providing additional surface area and creating controlled barriers. The intermediaries enable the steel plate to maintain its thickness for fine pitch control while still providing adequate solder for through hole components through the mediating effect of the insulating pads.
2Manufacturing precision
If the steel plate thickness is reduced to accommodate fine pitch electronic components, then the manufacturing precision for fine pitch soldering is improved, but the solder amount becomes insufficient for through hole standard package technologies
Solution Approach 1:
The patent introduces a vertical dimension by adding insulating pads with specific thicknesses (e.g., 0.05-0.15mm) around through hole openings. This dimensional addition creates extra space for solder accumulation in the vertical direction, allowing the steel plate to remain thin for fine pitch control while still providing sufficient solder volume for through hole components through the added height dimension.
Solution Approach 2:
The insulating pads create localized regions with enhanced solder capacity around through hole openings. By selectively placing these pads only where needed, the system maintains thin steel plate overall for fine pitch precision while providing localized solder enhancement for through hole components, resolving the contradiction between global thinness and local solder volume.
3Adaptability or versatility
If various electronic components with different types and pitches are disposed on the same circuit board, then the adaptability of the circuit board is improved, but the manufacturing precision for solder printing becomes difficult to control
Solution Approach 1:
The patent implements local quality by placing insulating pads selectively around through hole openings regardless of the surrounding component types. This localized modification creates uniform solder accumulation zones for through hole components while leaving other areas unchanged, allowing the system to accommodate various component types and pitches while maintaining consistent solder printing control through the standardized insulating pad approach.
Solution Approach 2:
The circuit board surface is segmented into different functional zones by the insulating pads. Through hole areas are segmented with additional solder accumulation zones, while other areas maintain their original characteristics. This segmentation allows different solder control strategies to be applied to different component types and pitches on the same board, resolving the contradiction between versatility and manufacturing precision.
Data Source
AI summary
A circuit board includes a circuit board plate, a conductive ring, a solder mask and at least one insulating pad. The circuit board plate includes a surface and a conductive through hole passing through the surface and the circuit board plate, wherein the conductive through hole have a conductive layer disposed on a wall thereof. The conductive ring on the surface surrounds an opening of the conductive through hole on the surface and electrically connects to the conductive layer. The solder mask is disposed on the surface. The conductive ring is exposed outside of the solder mask. The insulating pad has a thickness. The first surface of the insulating pad is adapted to contact the solder mask or the surface and sited at periphery of the conductive ring. The second surface of the insulating pad is adapted for spacing a distance between a solder coating tool and the solder mask.