Multi-Layer Circuit Board With Intermediate Layers For Signal Loss Reduction
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Solution Overview
Problem
Conventional circuit boards experience significant conductive loss during intermediate frequency signal transmission, particularly when integrated with multiple mm-wave antenna arrays, due to limitations in material cost and wire routing.
Innovation Solution
The circuit board design includes multiple layers with plating through holes to increase the distance between transmission wires and reference voltage planes, allowing for a wider transmission wire width, which reduces conductive loss by creating a reference voltage circumference to prevent electromagnetic wave loss and external interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If transmission wires are routed closer to reference voltage planes to reduce space, then device complexity is reduced, but conductive loss increases due to electromagnetic interference
Solution Approach 1:
The patent introduces intermediate layers between the transmission wire layer and reference voltage planes, transitioning from a two-dimensional planar arrangement to a three-dimensional layered structure. This vertical separation increases the distance between transmission wires and reference voltage planes, reducing electromagnetic interference and conductive loss while maintaining a compact overall design.
Solution Approach 2:
The intermediate layers act as mediators between the transmission wires and reference voltage planes. These layers provide physical separation and electromagnetic shielding, reducing the harmful interaction between transmission wires and reference voltage planes while maintaining the necessary electrical connections through controlled impedance design.
2Loss of energy
If transmission wire width is increased to reduce conductive loss, then conductive loss decreases, but device complexity increases due to larger space requirements
Solution Approach 1:
The patent utilizes the vertical dimension by introducing intermediate layers, which allows transmission wires to be positioned farther from reference voltage planes. This three-dimensional arrangement enables the use of wider transmission wires to reduce conductive loss without proportionally increasing the planar footprint, as the space requirement is addressed in the vertical dimension rather than the horizontal plane.
3Ease of manufacture
If material cost is reduced by using conventional materials, then manufacturing cost decreases, but conductive loss increases due to material limitations
Solution Approach 1:
The patent changes the structural parameters of the circuit board by introducing intermediate layers and increasing the distance between transmission wires and reference voltage planes. This parameter change allows the use of conventional, cost-effective materials while achieving lower conductive loss through improved geometric configuration and electromagnetic field management, rather than relying on expensive specialized materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces conductive loss in signal transmission, meeting specification requirements by increasing the width of transmission wires and minimizing interference, with a total conductive loss of less than 5.2 dB at 10 GHz when the wire width is set to 3.5 mil or larger.
Implementation Method 1
by increasing a distance between the transmission wires and the reference voltage plane, a width of the transmission wires can be increased correspondingly, a conductive loss of the transmission wires can be reduced to meet a requirement of specification
Data Source
AI summary
A circuit board includes a first layer, a second layer, a third layer, a plurality of plating through holes, at least one first intermediate layer and at least one second intermediate layer. The first layer and the second layer are used as reference voltage planes. A plurality of transmission wires are disposed on the third layer. The transmission wires are coupled to a wireless signal transceiver and a plurality of antenna arrays; wherein the third layer is disposed between the first layer and the second layer. The plating through holes are disposed at sides of the third layer, wherein the plurality of plating through holes are configured to connect the first reference voltage plane with the second reference voltage plane. The first intermediate layer is disposed between the first layer and the third layer, and the second intermediate layer is disposed between the second layer and the third layer.