Circuit Board Land Segmentation for Solder Inspection

The land is segmented into multiple regions with different widths: a first land portion with a first width, a second land portion with a second width greater than the first width, and a third land portion with a third width greater than the second width. This segmentation creates distinct solder joint formation zones that improve detection accuracy by providing varied solder shapes for successful versus failed joints.

Different portions of the land are given different local qualities through varying widths. The narrow first land portion creates a specific solder joint geometry that differs from the wider second and third portions, enabling the inspection device to distinguish successful solder joints based on the unique solder shape formed in the narrow region.

The land is divided into three sequential portions along the longitudinal direction, creating a stepped width profile. This segmentation achieves improved detection accuracy through distinct solder formation zones while maintaining a relatively simple manufacturing process by using standard PCB fabrication techniques to create the varying widths.

The land width varies in the lateral dimension while extending in the longitudinal dimension, creating a two-dimensional width profile. This dimensional variation provides multiple solder joint formation zones without adding vertical complexity or requiring three-dimensional structures, thus improving detection while controlling overall complexity.