Circuit Board Layer Severing for Precise Edge Definition
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Solution Overview
Problem
The existing methods for producing multi-layer printed circuit boards face challenges in efficiently removing partial areas without damaging underlying components, requiring complex additional steps, expensive materials, and additional conductive layers for protection during laser cutting, which increases production effort and complexity.
Innovation Solution
The method involves severing the edges of the partial area to be removed before application, creating a predetermined breaking point for easy removal, and filling the severed area with a removable material to protect underlying structures, allowing for precise edge definition and simplified separation without additional conductive layers or expensive materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional methods are used to remove partial areas of printed circuit board layers, then the underlying components can be exposed, but the process requires complex additional steps including protective conductive layers and expensive materials
Solution Approach 1:
The method applies preliminary action by creating severing lines in the material layers before they are applied to the core element. These pre-formed severing lines serve as predetermined breaking points that enable easy subsequent removal of partial areas without requiring complex protective measures or additional processing steps during the removal phase.
Solution Approach 2:
The method segments the material layers by creating discrete severing lines that divide the layers into removable partial areas and retained areas. This segmentation allows for selective removal of specific regions while leaving other areas intact, eliminating the need for full-surface protective conductive layers and simplifying the overall manufacturing process.
2Manufacturing precision
If laser cutting is used to remove partial areas, then precise cutting is achieved, but additional conductive layers are required to prevent damage to underlying components
Solution Approach 1:
The severing lines are created in advance during the material layer preparation stage, before the layers are applied to the core element. This preliminary creation of cutting paths eliminates the need for subsequent laser cutting operations that would require protective conductive layers, while still achieving precise edge definitions through the controlled severing process.
3Ease of operation
If prefabricated adhesive films with recesses are used to prevent layer connections, then separation is enabled, but registration and alignment demands increase
Solution Approach 1:
The method employs self-service by forming severing lines directly in the material layers during their application process, without requiring separate prefabricated adhesive films with pre-formed recesses. The severing lines are created as an integral part of the material layer structure itself, eliminating the need for additional alignment and registration steps between separate components.
Data Source
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AI summary
A method for producing a circuit board comprising the following steps:—providing at least one first element of the circuit board to be produced, more particularly a multilayer core element;—applying an adhesion-preventing material to a region of the first element to be subsequently exposed;—applying at least one additional layer to the first element;—connecting the first element and the at least one additional layer; and—removing a portion of the additional layer to expose the region of the first element, wherein in the additional layer corresponding to the portion to be subsequently removed, the material of the additional layer is cut through on at least one edge of the portion to be subsequently removed.