Circuit Board Lead Pattern for 5-Axis Camera Shake Correction
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Solution Overview
Problem
Conventional camera shake correction modules are limited in correcting various kinds of camera shake, particularly in the x-axis, y-axis directions, and rotation about the z-axis, and require complex spring structures for autofocus and handshake compensation, leading to reliability issues and manufacturing challenges.
Innovation Solution
A circuit board design with a lead pattern portion having specific roughness and tensile strength, integrated with a sensor driving device, allows for simultaneous hand shake correction in x, y, and z-axis directions, simplifying the spring structure and improving electrical signal transmission reliability by using a rolled metal layer with surface treatment to enhance adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional spring structures are used for autofocus and handshake compensation, then the camera module can provide basic shake correction, but the device complexity increases and reliability decreases
Solution Approach 1:
The patent merges the electrical signal transmission function and the spring function into a single integrated lead pattern portion. This eliminates the need for separate spring structures and electrical connections, thereby reducing device complexity while improving reliability through the unified design.
Solution Approach 2:
The lead pattern portion is designed to perform multiple functions simultaneously: it provides electrical signal transmission, acts as a spring for autofocus and handshake compensation, and offers mechanical support. This multi-functionality reduces the number of components needed and simplifies the overall device structure.
2Adaptability or versatility
If lens shift method is used for camera shake correction, then the structure is simpler, but the ability to correct various kinds of camera shake (x-axis, y-axis, rotation) is limited
Solution Approach 1:
The image sensor is designed to perform multiple correction functions simultaneously: it can correct x-axis shake, y-axis shake, and rotation about the z-axis through its multi-degree-of-freedom movement capability. This universal correction ability is achieved through the flexible lead pattern structure that supports complex motion.
Solution Approach 2:
The lead pattern portion is designed with dynamic flexibility, allowing the image sensor to move in multiple directions (x-axis, y-axis, and rotation) rather than being fixed in a rigid structure. This dynamic design enables comprehensive shake correction while maintaining structural integrity.
3Reliability
If the lead pattern portion has high tensile strength and specific roughness, then the reliability of electrical signal transmission improves, but the manufacturing precision requirements increase
Solution Approach 1:
The patent specifies optimal parameter ranges for the lead pattern portion, including tensile strength of at least 1000 N/mm² and surface roughness (Ra) of 0.05 μm to 0.5 μm. These parameter changes ensure both high reliability of electrical signal transmission and manufacturability within controlled tolerances.
Solution Approach 2:
The lead pattern portion uses a composite structure with a metal layer and a plating layer, combining the high strength of metal with the controlled surface properties of plated materials. This composite approach achieves both the required tensile strength and surface roughness characteristics.
Data Source
AI summary
Discussed is a circuit board including an insulating layer, and a lead pattern part disposed on the insulating layer. The lead pattern part has a centerline average roughness in a range of 0.05 μm to 0.5 μm or a 10-point average roughness in a range of 1.0 μm to 5.0 μm.