Insulated Circuit Board Layout for Low-Inductance Semiconductor Packaging
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Solution Overview
Problem
Existing semiconductor devices face challenges in reducing the resistance and inductance of conductive patterns on insulated circuit boards, which affects their performance and efficiency.
Innovation Solution
The semiconductor device incorporates a specific configuration with inter-substrate spacers and conductive patterns, where the fourth side of the conductive pattern extends obliquely, eliminating the need for additional solder material and reducing the resistance and inductance of the conductive patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional conductive patterns with right-angled sides are used, then manufacturing is simpler, but resistance and inductance are higher
Solution Approach 1:
The conductive pattern employs asymmetric geometry where three sides extend in orthogonal directions while the fourth side extends obliquely at an angle between 45-135 degrees relative to the orthogonal directions. This asymmetric design reduces both resistance and inductance by optimizing current flow paths and reducing eddy currents, while maintaining manufacturability through standard photolithography processes.
Solution Approach 2:
The oblique fourth side of the conductive pattern introduces a curved or angled geometry that replaces sharp right angles. This curvature effect reduces inductance by smoothing current flow transitions and reducing electromagnetic radiation, while still being compatible with conventional PCB manufacturing techniques.
2Strength
If additional solder material is used to secure spacers, then mechanical strength is improved, but resistance and device complexity increase
Solution Approach 1:
The conductive pattern serves dual functions: it provides electrical conduction and simultaneously acts as an adhesive bonding layer to secure the inter-substrate spacer. This merging eliminates the need for separate solder materials and processes, reducing device complexity while maintaining mechanical strength through the conductive pattern's inherent adhesive properties.
Solution Approach 2:
The conductive pattern is designed to perform multiple functions simultaneously: electrical conduction, mechanical bonding of the spacer, and structural support. This multi-functionality reduces the number of components and assembly steps required, simplifying the overall device structure while maintaining or improving mechanical strength.
Data Source
AI summary
According to one embodiment, a semiconductor device includes a first insulated circuit board, a second insulated circuit board, a first semiconductor chip and a first spacer. The first insulated circuit board includes a first conductive plate. The first conductive plate has a first conductive pattern. The first spacer is placed on the first conductive pattern. The first conductive pattern has a first side, a second side, a third side and a fourth side which surround the first spacer. The first side extends in a first direction. The second side continues to the first side and extends in a second direction that is orthogonal to the first direction. The third side continues to the second side and extends in the first direction. The fourth side continues to the third side and extends obliquely to the first direction and the second direction.