Multilayer Circuit Board Parasitic Inductance Reduction
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Solution Overview
Problem
In power conversion devices, parasitic inductance affects semiconductor switching elements, leading to increased ON resistance, conduction loss, and switching time, while existing solutions focus on cooling bus bars rather than enhancing heat dissipation of semiconductor elements and reducing parasitic inductance effects.
Innovation Solution
The electronic circuit device employs a multilayer circuit board with a first and second wiring pattern and vias for heat transfer, where the first wiring pattern forms a virtual shortest current path and the second pattern forms an opposing current path, canceling magnetic fields and efficiently dissipating heat through a heat dissipation member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wiring patterns are extended to connect circuit elements, then electrical connection is achieved, but parasitic inductance increases
Solution Approach 1:
The invention utilizes the vertical dimension by routing current paths through vias between layers, creating three-dimensional current loops that reduce the horizontal area enclosed by current paths, thereby minimizing parasitic inductance while maintaining electrical connectivity
Solution Approach 2:
Instead of extending wiring patterns horizontally to connect circuit elements, the invention inverts the approach by using vertical vias and opposing current paths on different layers to achieve connection, effectively reducing the loop area and parasitic inductance
2Reliability
If high withstand voltage switching elements are used, then voltage tolerance is improved, but switching loss increases
Solution Approach 1:
The invention creates a low-inductance structure that acts as a protective electromagnetic environment for low withstand voltage switching elements, allowing them to operate efficiently without the high switching losses associated with conventional high-voltage elements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces parasitic inductance, decreases switching loss, allows for the use of low withstand voltage switching elements, and enhances heat dissipation, minimizing adverse effects on semiconductor switching elements.
Implementation Method 1
vias for heat transfer, configured to connect a mount area for the switching element on the first main surface with the second main surface, in an area on a side of the opposing current path. The heat dissipation member is in contact with the second main surface, and heat generated in the switching element is dissipated by the heat dissipation member through the vias for heat transfer.
Implementation Method 2
a second wiring pattern formed on a surface of a specific layer including a second main surface opposing the first main surface, the second wiring pattern including an opposing current path that opposes an area where the virtual shortest current path is formed
Data Source
AI summary
The electronic circuit device includes: a first wiring pattern which is formed on a first main surface of a circuit board, has circuit elements including a switching element and mounted along a predetermined direction, and includes a virtual shortest current path connecting the circuit elements to each other along the predetermined direction; a second wiring pattern which is formed on a second main surface, and includes an opposing current path that opposes an area where the virtual shortest current path is formed; vias electrically connecting the first and second wiring patterns; and vias for heat transfer, connecting a mount area for the switching elements on the first main surface with an area on a side of the opposing current path on the second main surface. The heat dissipation member is in contact with the second main surface.