Oxidation-Resistant Circuit Board Layout for Mini-LED Connections
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Solution Overview
Problem
Mini-LED and micro-LED products face high costs due to poor oxidation resistance of copper connections and complex manufacturing processes involving multiple mask layers.
Innovation Solution
A circuit board design with a base substrate and an electrical pattern that includes conductive layers with protective layers to enhance oxidation resistance, simplifying the manufacturing process by integrating connection pads and conductive patterns in a single layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper connections are used in the circuit board, then electrical conductivity is improved, but oxidation resistance deteriorates
Solution Approach 1:
The patent applies composite materials by creating a multi-layer structure consisting of a copper base layer providing electrical conductivity and an oxide-resistant protective layer (such as nickel or palladium) on top. This composite structure combines the advantages of copper's excellent conductivity with the oxidation resistance of protective materials, resolving the contradiction between conductivity and oxidation resistance.
2Manufacturing precision
If multiple mask layers are used in the manufacturing process, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple mask layers into a single integrated mask structure that defines both the conductive pattern and the protective layer pattern simultaneously. This single-mask approach maintains manufacturing precision by ensuring perfect alignment between layers while significantly reducing process complexity by eliminating sequential masking steps and intermediate alignment procedures.
Solution Approach 2:
The patent segments the manufacturing process by forming the conductive pattern and protective layer pattern in separate sequential steps using a single mask, rather than using multiple masks simultaneously. This segmentation allows each layer to be formed independently with precise control while avoiding the complexity of multi-mask alignment, resolving the contradiction between precision and process simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves oxidation resistance, reduces manufacturing complexity, and lowers production costs while maintaining effective electrical connections for mini-LED and micro-LED products.
Implementation Method 1
A material of the first main material layer includes copper, and the first main material layer is capable of forming a first intermetallic compound with solder
Implementation Method 2
The first protective layer and the second protective layer are used to enhance oxidation resistance of the electrical pattern
Implementation Method 3
The first stop layer is capable of forming a third intermetallic compound with the solder, and a reaction rate between the first stop layer and the solder is less than a reaction rate between the second main material layer and the solder
Data Source
AI summary
A circuit board includes a base substrate and an electrical pattern. The electrical pattern is arranged on the base substrate and includes a plurality of conductive patterns and a plurality of connection pads. Each conductive pattern is electrically connected to at least one connection pad. The electrical pattern is composed of a first conductive layer and/or a second conductive layer, wherein the second conductive layer covers a side of the first conductive layer away from the base substrate and two sides of the first conductive layer in the extension direction thereof. The electrical pattern further includes at least one of a first protective layer and a second protective layer, wherein the first protective layer and the second protective layer are used for improving the oxidation resistance of the electrical pattern. Either of the first protective layer and the second protective layer can form a second intermetallic compound with solder.