Multi-Layer Circuit Board Connection Pads for Display Devices
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Solution Overview
Problem
Existing display device technologies face challenges in efficiently connecting circuit boards to display panels using conventional methods, such as anisotropic conductive films or ultrasonic bonding, which can be complex and may not fully utilize the potential of different conductive materials for enhanced conductivity and manufacturing simplicity.
Innovation Solution
A circuit board design featuring multiple conductive layers with varying materials and thicknesses, where each layer is strategically positioned and bonded using an ultrasonic method to improve electrical connections and manufacturing efficiency, with specific configurations of first and second connection pads and signal lines to enhance bonding efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional connection methods (anisotropic conductive film or ultrasonic bonding) are used to connect the circuit board to the display panel, then the connection can be established, but the manufacturing process becomes complex and conductivity is not optimized
Solution Approach 1:
The connection pad employs a multi-layer composite structure with different materials: a first conductive layer (e.g., aluminum or aluminum alloy) for basic conductivity, a second conductive layer (e.g., copper or copper alloy) for enhanced conductivity, and a third conductive layer (e.g., titanium or titanium alloy) for oxidation resistance. This composite material approach optimizes both electrical performance and connection reliability while simplifying the manufacturing process by integrating multiple functions into a single pad structure.
Solution Approach 2:
Different regions of the connection pad have different material compositions tailored to specific functional requirements. The first conductive layer provides mechanical bonding and basic conductivity, the second layer enhances electrical conductivity in the bonding region, and the third layer provides oxidation protection at the exposed surface. This local differentiation of material properties resolves the contradiction by achieving high reliability through targeted material placement rather than complex overall structures.
2Reliability
If a single-layer conductive pad is used, then the manufacturing process is simple, but conductivity and oxidation resistance are not optimized
Solution Approach 1:
The connection pad uses a three-layer composite conductive structure where each layer serves a specific function: the first layer (aluminum-based) provides mechanical strength and basic conductivity, the second layer (copper-based) enhances electrical conductivity, and the third layer (titanium-based) prevents oxidation. This composite approach achieves superior electrical connection reliability while remaining manufacturable through standard thin-film deposition processes.
Solution Approach 2:
The conductive pad is segmented into three distinct functional layers, each with optimized material properties. This segmentation allows each layer to perform its specific function (mechanical support, electrical conductivity enhancement, oxidation protection) without interfering with the others, thereby achieving high reliability through functional specialization rather than material complexity.
3Reliability
If the first conductive layer is made thicker to improve conductivity, then electrical connection is enhanced, but the pad becomes more prone to oxidation and manufacturing complexity increases
Solution Approach 1:
The solution combines a thicker first conductive layer (aluminum-based, 50-200 nm) for enhanced electrical conductivity and mechanical strength with a third conductive layer (titanium-based, 5-50 nm) that provides oxidation resistance. The composite structure allows the aluminum layer to be sufficiently thick for good conductivity while the titanium layer protects it from oxidation, resolving the contradiction between conductivity enhancement and oxidation susceptibility.
Solution Approach 2:
The third conductive layer (titanium-based) acts as an intermediary protective barrier between the thicker first conductive layer (aluminum-based) and the external environment. This intermediary layer prevents direct exposure of the aluminum to oxygen, thereby protecting it from oxidation while allowing the aluminum layer to maintain its thick configuration for optimal electrical conductivity and mechanical properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution enables robust and efficient electrical connections between the circuit board and display panel, improving conductivity and simplifying the manufacturing process while preventing oxidation reactions, thus enhancing the overall performance and reliability of the display device.
Implementation Method 1
The method of connecting the display panel and the circuit board by the ultrasonic bonding method may increase conductivity and may simplify manufacturing processes
Data Source
AI summary
A circuit board includes a board, first connection pads disposed on the board and arranged in a first direction, second connection pads disposed on the board and arranged in the first direction, the second connection pads spaced apart from the first connection pads in a second direction perpendicular to the first direction, and a driving chip disposed on the board between the first connection pads and the second connection pads. Each of the first connection pads includes a first conductive layer disposed on the board, a second conductive layer which entirely overlaps with the first conductive layer in a plan view, is disposed on the first conductive layer and is formed of a different material from that of the first conductive layer, and a third conductive layer entirely overlapping with the second conductive layer and disposed on the second conductive layer.