Circuit Board PCM Pockets for Thin-Device Heat Dissipation
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Solution Overview
Problem
Conventional heat sinks for electronic devices, especially in thin devices like tablet computers, face challenges due to limited internal space, as they consume valuable space and are not optimized for compact thermal management.
Innovation Solution
Incorporating phase change material (PCM) pockets on or in the circuit board to absorb and store heat, providing effective thermal management by establishing thermal contact with components through conductive pathways, such as pins or ball grid arrays, allowing for efficient heat dissipation without increasing device thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat sinks are used for thermal management, then heat dissipation is achieved, but device thickness increases and internal space is consumed
Solution Approach 1:
The patent merges the thermal management function directly into the circuit board by embedding phase change material pockets within the board structure itself. This integration eliminates the need for separate external heat sinks, thereby maintaining heat dissipation capability while reducing device thickness and internal space consumption.
Solution Approach 2:
The patent utilizes phase change materials that absorb and store heat through phase transitions (e.g., solid to liquid). These PCM pockets are positioned in thermal contact with heat-generating components, allowing them to passively manage thermal loads by absorbing excess heat during phase change, thereby providing effective thermal management without requiring bulky heat sinking structures.
2Temperature
If conventional heat sinks are used, then thermal management is provided, but space efficiency is reduced
Solution Approach 1:
The circuit board is designed to perform dual functions: electrical connectivity and thermal management. By embedding phase change material pockets directly within the board structure, the patent combines the support substrate function with the thermal management function, eliminating the need for separate heat sink components and thereby maximizing internal space efficiency.
Solution Approach 2:
The phase change material pockets are nested within the circuit board structure, utilizing the board's internal volume for thermal management purposes. This nesting approach allows the thermal management system to be contained within the existing device envelope, thereby providing effective heat dissipation without consuming additional internal space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The PCM pockets facilitate efficient heat management by absorbing and storing heat, enabling effective thermal dissipation in compact devices without the need for bulky heat sinks, thus maintaining performance and user comfort while minimizing space usage.
Implementation Method 1
a first phase change material pocket positioned on or in the circuit board and contacting a surface of the circuit board
Implementation Method 2
Thermal contact between the phase change material pocket and the component is established
Data Source
AI summary
Various circuit board embodiments are disclosed. In one aspect, an apparatus is provided that includes a circuit board and a first phase change material pocket positioned on or in the circuit board and contacting a surface of the circuit board.