Thermally Conductive Pillar Circuit Board for Camera Module Heat Dissipation
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Solution Overview
Problem
The increasing thermal resistance and limited contact area between the circuit substrate and sensor chip in camera modules lead to heat dissipation issues, causing the sensor chip to overheat and potentially burn out due to the thinner and lighter design of circuit substrates.
Innovation Solution
The implementation of a circuit board manufacturing method that includes a circuit substrate with thermally conductive pillars and a thermally conductive agent, where the thermally conductive agent undergoes a phase change to enhance heat dissipation through the formation of thermally conductive steam, facilitating efficient heat transfer from the heating element to the outer layers of the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If the circuit substrate is made lighter and thinner, then the weight and thickness of the camera module are reduced, but the thermal resistance increases and heat dissipation capability deteriorates
Solution Approach 1:
The patent divides the heat dissipation function into multiple segments: thermally conductive pillars (solid phase), thermally conductive liquid filling gaps, and steam phase for convection. This segmentation allows each component to address specific heat transfer needs, resolving the contradiction between thin substrate design and heat dissipation capability.
Solution Approach 2:
The patent utilizes phase transition of the thermally conductive liquid (evaporation to steam and condensation back to liquid) as a heat dissipation mechanism. The steam rises and condenses on cooler surfaces, creating a continuous heat transfer cycle that effectively removes heat from the sensor chip without requiring a thick substrate.
2Area of moving object
If the contact area between circuit substrate and sensor chip is limited, then the integration density increases, but the heat dissipation efficiency deteriorates
Solution Approach 1:
The patent introduces thermally conductive pillars and thermally conductive liquid as intermediary substances between the sensor chip and circuit substrate. These intermediaries fill the gaps and voids in the limited contact area, providing additional thermal conduction pathways that compensate for the reduced contact area while maintaining high integration density.
Solution Approach 2:
The patent employs a composite heat dissipation system combining solid thermally conductive pillars, liquid thermally conductive material, and steam phase. This composite approach leverages the advantages of each material state (conduction through solids, convection through steam) to achieve effective heat dissipation despite limited contact area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively addresses the heat dissipation challenges by increasing the thermal conductivity and dissipation efficiency, preventing overheating and potential damage to the sensor chip, thereby ensuring reliable operation of camera modules.
Implementation Method 1
the thermally conductive agent undergoes a phase change to enhance heat dissipation through the formation of thermally conductive steam
Implementation Method 2
thermally conductive pillars 14 and a thermally conductive agent 15... facilitate efficient heat transfer from the heating element to the outer layers
Data Source
AI summary
A circuit board includes a first outer wiring layer, a circuit substrate, and a second outer wiring layer stacked. The circuit substrate includes a first inner wiring layer, an insulating layer, and a second inner wiring layer stacked. A plurality of thermally conductive pillars is arranged at intervals on the first inner wiring layer, a liquid storage space is formed between every two adjacent thermally conductive pillars, and a thermally conductive agent is received in the liquid storage space. The first outer wiring layer is formed on the plurality of thermally conductive pillars. The second outer wiring layer is formed the second inner wiring layer. A first groove penetrates the second outer wiring layer, the second inner wiring layer and the insulating layer, exposes a portion of the first inner wiring layer, and corresponds to the thermally conductive pillars. At least one heating element is installed in the first groove.