Power Plane Layout in Circuit Boards for Crosstalk and Heat
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Solution Overview
Problem
High-speed integrated circuit chips face issues of signal crosstalk and overheating due to multiple power planes connected to different circuit blocks, exacerbated by package structure limitations and high power consumption.
Innovation Solution
A circuit board design with four power planes, where the second power plane provides the maximum current and power, and is divided into sub-power planes to reduce signal interference, while the layout of power planes minimizes resistance and overheating by optimizing their projections and areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the same power plane is connected to multiple different circuit blocks, then the power distribution is simplified, but signal crosstalk increases
Solution Approach 1:
The power layer is segmented into multiple separate power planes (first, second, third, and fourth power planes), each serving specific circuit blocks. This segmentation prevents the same power plane from connecting to multiple different circuit blocks, thereby reducing signal crosstalk while maintaining manageable power distribution complexity through systematic arrangement.
2Power
If multiple power planes are used to provide different voltages, then the power supply capability is improved, but the circuit board resistance increases causing overheating
Solution Approach 1:
Each power plane is designed with optimized local characteristics, including specific area allocations and strategic positioning. The second power plane is positioned to extend through at least three sides of the package region, providing optimal power distribution with minimized resistance. This local optimization ensures that each power plane contributes efficiently to power supply while minimizing heat generation.
3Quantity of substance
If the package structure size is limited, then the integration density is improved, but the power plane area is reduced increasing resistance
Solution Approach 1:
The power planes are strategically extended along the perimeter of the package region, with the second power plane extending through at least three sides. This dimensional arrangement maximizes the utilization of available space within the limited package structure, increasing effective power transmission area without compromising integration density. The orthogonal projection areas are optimized to ensure adequate power delivery while maintaining high integration.
Data Source
AI summary
A circuit board is suitable for mounting an electronic package. The circuit board includes a power layer and a circuit board surface which includes a package region corresponding to the electronic package. The package region is rectangular and includes four sides. The power layer includes a first power plane, a second power plane, a third power plane, and the forth power plane. An orthographic projection of the second power plane on the circuit board surface extends from outside into the package region and extending through at least three of the sides. An area of the orthogonal projection of the second power plane on the circuit board surface in the package region is greater than areas of the orthogonal projections of the other power planes on the circuit board surface in the package region. In addition, an electronic assembly including the circuit board and the electronic package is also provided.