Multi-Layer Circuit Board 3D Printed Insulation Bumps
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Solution Overview
Problem
Conventional methods for high-density circuit board manufacturing, such as the buried bump interconnection technology, face challenges with complex processes, high pollution, and low yield due to the use of conductive materials with high viscosity and low thixotropic index, leading to skewed conductive bumps and inadequate interlayer connections.
Innovation Solution
A multi-layer circuit board is fabricated using a 3D printing technique with ceramic-like insulation bumps and conductive layers, where the bumps are printed using a ceramic-like material to prevent skewing and simplify the process, reducing material consumption and environmental pollution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conductive paste with high viscosity and low thixotropic index is used to fabricate bumps, then the bumps can be formed, but the bumps are prone to skew during pressing and puncturing, reducing production yield
Solution Approach 1:
The patent changes the material parameter from conductive paste to ceramic-like material, which fundamentally alters the viscosity and thixotropic index characteristics. This material substitution enables the bumps to maintain their shape and positioning accuracy during the pressing and puncturing processes without skewing, thereby resolving the contradiction between manufacturing precision and production yield
Solution Approach 2:
The patent employs ceramic-like material as an insulating material with specific mechanical properties that combine both structural support and dimensional stability. This composite material approach allows the bumps to resist deformation during processing while maintaining precise positioning, thus improving both manufacturing precision and production yield simultaneously
2Manufacturing precision
If conventional conductive paste printing is used to form bumps, then the bumps can be created, but multiple printing and curing cycles (4-5 times) are required to reach design height, complicating the process
Solution Approach 1:
The patent changes the material parameters by substituting ceramic-like material for conductive paste, which enables single-step printing to achieve the required bump height. This eliminates the need for multiple printing and curing cycles, thereby reducing process complexity while maintaining height accuracy
Solution Approach 2:
The ceramic-like material is prepared in advance with optimal printing characteristics that allow the bumps to be formed to the exact design height in a single printing operation. This preliminary material preparation eliminates the need for iterative printing processes, simplifying the overall manufacturing process
3Reliability
If laser drilling and metal hole filling are used for interlayer interconnection, then electrical connection can be achieved, but the process becomes complex and requires high pollution post-treatment
Solution Approach 1:
The patent extracts and eliminates the harmful post-treatment steps associated with laser drilling and metal hole filling. By using ceramic-like insulating bumps with integrated conductive layers, the method removes the need for complex metal filling and associated pollution-generating processes, while maintaining electrical connection reliability
Solution Approach 2:
The patent converts the traditionally harmful conductive paste material into a beneficial ceramic-like insulating material that eliminates pollution. The ceramic material's inherent properties allow for cleaner manufacturing without compromising the electrical connection functionality, turning a harmful process into a beneficial one
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances material properties, simplifies the manufacturing process, and improves yield by using ceramic-like insulation bumps, ensuring better connectivity and reducing production complexity and environmental impact.
Implementation Method 1
The plurality of insulation bumps includes being formed by a 3D printing method
Implementation Method 2
a conductive paste used to fabricate the bumps has material properties of high viscosity and low thixotropic index (TI)
Data Source
AI summary
A multi-layer circuit board including a plurality of insulation bumps, a first conductive layer, and a second conductive layer is provided. The plurality of insulation bumps are disposed between a first substrate and a second substrate. A top portion of the plurality of insulation bumps is served as a circuit connection point. The first conductive layer is disposed on the first substrate and connected to the circuit connection point. The second conductive layer is disposed on the second substrate and connected to the circuit connection point.