Circuit Board Printing Method with Position Adjustment
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Solution Overview
Problem
Conventional multilayer circuit board manufacturing processes are complex, lead to material over-consumption and environmental pollution, and result in poor yield due to tolerance issues in drilling, lithography, and etching steps.
Innovation Solution
A manufacturing method using printing processes to form insulating and conductive layers, with real-time position checking and adjustment to ensure accurate alignment and connection of circuit layers, employing 3D DLP for insulating layers and conductive ink jet printing for conductive layers, and forming holes in insulating layers to create conductive plugs when position deviations exceed tolerance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional mechanical drilling or laser drilling process is used to form vertical holes, then holes can be formed in substrate, but manufacturing complexity increases and tolerance issues arise leading to poor yield
Solution Approach 1:
The patent replaces conventional mechanical drilling or laser drilling processes with a printing process to form conductive patterns and connections. Instead of using mechanical drills or laser beams to create holes and deposit conductive material, the invention uses a printing apparatus to directly print conductive ink or paste onto the substrate, eliminating the need for separate drilling and plating operations. This substitution reduces manufacturing complexity while improving position accuracy through direct digital printing control.
Solution Approach 2:
The patent changes the fundamental parameter of how conductive connections are formed - from subtractive/mechanical drilling to additive printing. By controlling the printing parameters such as ink deposition amount, printing resolution, and layer thickness, the system achieves precise hole formation and conductive pattern creation in a single integrated process, thereby improving manufacturing precision while reducing process complexity.
2Manufacturing precision
If conventional lithography and etching process is used to form circuit patterns, then circuit patterns can be formed, but material over-consumption occurs and environmental pollution increases
Solution Approach 1:
The patent replaces the multi-step lithography and etching process with a direct printing process. Instead of applying photoresist, exposing through masks, developing, and etching, the invention uses a printing apparatus to directly deposit conductive material in the desired pattern. This eliminates the need for chemical etchants and photoresist solvents, significantly reducing material over-consumption and environmental pollution while maintaining or improving circuit pattern accuracy through digital control.
Solution Approach 2:
The patent extracts and eliminates the unnecessary intermediate steps of conventional lithography and etching processes. By directly printing conductive patterns onto the substrate, the invention removes the need for photoresist materials, masking materials, and chemical etchants, thereby reducing material waste and environmental impact while achieving precise circuit patterns through controlled material deposition.
3Productivity
If conventional drilling, lithography and etching steps are performed with tolerance requirements, then circuit board can be manufactured, but yield decreases due to accumulated tolerance errors
Solution Approach 1:
The patent merges multiple separate manufacturing steps (drilling, lithography, etching, plating) into a single integrated printing process. By combining these operations into one digital printing step, the invention eliminates the accumulation of tolerance errors that occur when multiple steps are performed sequentially. Each printing operation can be precisely controlled and registered to previous layers, ensuring high reliability and yield while maintaining manufacturing efficiency.
Solution Approach 2:
The patent implements feedback control in the printing process by using alignment marks and real-time position detection. The system detects the actual position of previously printed layers and adjusts subsequent printing operations accordingly, compensating for any deviations. This feedback mechanism ensures that tolerance accumulation is minimized, thereby improving circuit board yield while maintaining high manufacturing efficiency through automated correction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces material consumption, minimizes environmental pollution, and enhances the yield of circuit boards by ensuring accurate connections and efficient signal transmission, avoiding issues of open circuits and material waste.
Implementation Method 1
a first printing process is performed to form a first insulating layer having a first circuit depressed pattern
Implementation Method 2
a second printing process is performed to form a first circuit layer in the first circuit depressed pattern
Data Source
AI summary
A manufacturing method of a circuit board includes: performing a first printing process to form a first insulating layer having a first circuit depressed pattern; performing a second printing process to form a first circuit layer in the first circuit depressed pattern; checking whether a real position of the first circuit layer is diverged from a predetermined position; determining whether the shift level of the position of the first circuit layer is more than a predetermined level; performing the first printing process to form the second insulating layer, wherein when the shift level is more than the predetermined level and the thickness of a second insulating layer to be formed on the first insulating layer is not greater than a tolerance thickness, the second insulating layer has a hole at least partially overlapping the real position; and performing the second printing process to form a conductive plug in the hole.