Circuit Board Protection Element for Mechanical Impact Resistance

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Solution Overview

Problem

Existing circuit board protection methods, such as shield plates, are unsuitable for thin applications and can cause mechanical stresses due to thermal expansion differences, and fail to protect components from angled impacts.

Innovation Solution

A method involving a protection element with a thickness perpendicular to the circuit board and a width greater than its thickness, made from the same material as the circuit board or incorporating rubber for flexibility, which provides galvanic connections between functional entities while allowing access and cooling, and is designed to prevent mechanical impacts without increasing the board's thickness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a shield plate is used to protect electrical components, then mechanical protection is improved, but the device thickness increases and thermal expansion differences cause mechanical stresses

Engineering Contradiction:
Improvemechanical protectionVSAvoiddevice thickness
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The protection element is integrated directly into the circuit board as a single structural unit, eliminating the need for separate shield plates and spacers. This merging approach provides mechanical protection while maintaining the original device thickness, as the protection element becomes part of the board structure itself rather than an additive component.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The protection element is made from the same material as the circuit board, ensuring homogeneous thermal expansion characteristics. This eliminates mechanical stresses that would otherwise arise from thermal expansion differences between dissimilar materials, while the integrated structure provides the needed mechanical protection.

Inventive Principle:
Principle #33Homogeneity

2Reliability

If a shield plate with spacers is used, then mechanical protection is improved, but different thermal expansion coefficients cause mechanical stresses and deformations

Engineering Contradiction:
Improvemechanical protectionVSAvoidmechanical stability
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The protection element is made from the same material as the circuit board, ensuring homogeneous thermal expansion characteristics. This eliminates mechanical stresses that would otherwise arise from thermal expansion differences between dissimilar materials, while the integrated structure provides the needed mechanical protection.

Inventive Principle:
Principle #33Homogeneity

Solution Approach 2:

The circuit board system combines the protective function with the board material itself, creating a composite structure where the protection element and circuit board materials work together with compatible thermal properties, preventing deformations while maintaining mechanical stability.

Inventive Principle:
Principle #40Composite materials

3Reliability

If the protection element covers electrical components, then mechanical protection is improved, but access for testing and cooling is hindered

Engineering Contradiction:
Improvemechanical protectionVSAvoidaccess for testing and cooling
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The protection element features locally differentiated properties with openings positioned exactly where electrical components are located. This allows the majority of the protection element to provide mechanical protection while the strategically placed openings maintain access for testing and cooling operations, achieving protection without compromising operational access.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively protects electrical components from mechanical impacts, maintains thinness, allows access for testing, and adapts to thermal expansion, ensuring reliable functionality and durability.

Implementation Method 1

the protection element comprises electrically conductive parts connected to electrically conductive parts of the circuit board and providing at least one galvanic connection between a first functional entity of the circuit board system and a second functional entity of the circuit board system

Methodology Applied
Scientific EffectGalvanic connection:

Implementation Method 2

different thermal expansion coefficients of the circuit board and the shield plate may cause mechanical stresses and/or deformations in the circuit board system

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS10201095B2Method for manufacturing a circuit board system with mechanical protection
Publication Date: 2019.02.05 CORIANT
  • US10201095B2 patent drawing
  • US10201095B2 patent drawing
  • US10201095B2 patent drawing

AI summary

A method for manufacturing a circuit board system comprising mechanical protection of electrical components is presented. The circuit board system comprises a circuit board (101) furnished with electrical components (103-111) and a protection element (102) attached to areas of the circuit board which are free from the electrical components. The protection element has thickness in the direction perpendicular to the circuit board and it is shaped to leave the electrical components unscreened in the direction perpendicular to the circuit board. Thus, the protection element constitutes barriers protecting the electrical components but still allows the electrical components to be accessed from the direction perpendicular to the circuit board for example in a flying probe testing. Furthermore, the protection element provides electrical connections between functional entities of the circuit board system.