Circuit Board Resin Frame Molding Without Clamping Damage
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Solution Overview
Problem
Existing methods for manufacturing package units face issues such as circuit board cracking and deformation due to clamping during resin molding, especially when there are variations in board thickness, leading to damage to the conductor layer and resin material.
Innovation Solution
A method involving a circuit board with distinct regions and a mold having a frame-shaped protruding portion, where the board is arranged such that a gap between the protruding portion and the board allows resin to be poured, forming a frame-shaped resin member with a solder resist layer positioned between conductor layers, preventing direct clamping and reducing pressure on the board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the circuit board is clamped with a mold during resin molding, then the resin material can be properly formed, but cracks occur in the circuit board and internal wiring deforms
Solution Approach 1:
The mold is divided into multiple cavities (first cavity, second cavity, third cavity) separated by partition walls. The frame-shaped protruding portion further segments the second cavity, creating distinct molding zones that allow selective resin filling without requiring complete clamping of the circuit board, thus preventing cracks while enabling proper resin formation.
Solution Approach 2:
Different regions of the mold have different structures: the frame-shaped protruding portion creates a gap in specific areas (above conductor layers) to prevent clamping, while other regions maintain normal molding capability. This localized structural variation allows the mold to be gentle on the circuit board overall while still achieving proper resin formation in critical areas.
2Ease of manufacture
If pressure is applied over the entire contact region between circuit board and mold, then resin molding can be completed, but significant damage occurs to the conductor layer and resin material
Solution Approach 1:
The mold cavity is segmented into multiple regions by partition walls and the frame-shaped protruding portion. This segmentation allows pressure to be applied selectively to specific areas (first, second, and third cavities) rather than uniformly across the entire circuit board contact region, preventing damage to conductor layers while completing the resin molding process.
Solution Approach 2:
The frame-shaped protruding portion acts as an intermediary structure that prevents direct contact between the mold and the circuit board in critical areas. This intermediary creates a gap above the conductor layers, eliminating the harmful pressure transmission path that would otherwise damage the conductor layer and resin material.
Data Source
AI summary
A method of manufacturing a package unit, comprising: preparing a circuit board having a first region, a second region surrounding the first region, and a third region between the first and the second region; preparing a mold having a frame-shaped protruding portion surrounding a first cavity, the frame-shaped protruding portion partitioning the first cavity and a second cavity surrounding the first cavity; arranging the circuit board and the mold such that the first region of the circuit board faces the first cavity, the second region of the circuit board faces the second cavity, and a gap which communicates the first cavity and the second cavity with each other is formed between the frame-shaped protruding portion and the third region of the circuit board; and forming a frame-shaped resin member on top of the second region of the circuit board by pouring a resin into the second cavity.