Circuit Board Sealing Case Opening for Dust and Water Protection
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Solution Overview
Problem
Electronic devices face challenges in maintaining a dust-proof and water-proof structure, especially in environments with changing seasons, temperatures, or humidity, as existing solutions often require complex installations and may not effectively seal wiring paths and openings.
Innovation Solution
An electronic device design where a portion of the circuit board contacts the case member to seal openings, utilizing sealing members and conductive patterns to create a stable dust-proof and water-proof structure, allowing for miniaturization while ensuring operational stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate dust-proof structure and water-proof structure are installed, then the sealing performance is improved, but the device complexity increases
Solution Approach 1:
The patent merges the dust-proof structure and water-proof structure into a single integrated sealing structure. The grommet simultaneously provides both dust sealing and water sealing functions by forming a unified barrier that prevents both dust and moisture from entering through the wiring path opening, thereby improving sealing performance while reducing structural complexity
Solution Approach 2:
The grommet is designed as a multi-functional component that serves multiple purposes: it seals the opening, protects the wiring path, prevents dust intrusion, and prevents water intrusion. This universal component replaces what would traditionally require separate specialized structures for each function, achieving both dust-proof and water-proof protection through a single element
2Reliability
If complex dust-proof and water-proof structures are installed, then the sealing performance is improved, but the device size increases
Solution Approach 1:
By combining multiple sealing functions into a single grommet component, the patent eliminates the need for multiple separate sealing structures that would occupy additional space. The integrated design achieves comprehensive dust and water protection while maintaining a compact form factor suitable for miniaturized devices
Solution Approach 2:
The grommet is installed within the opening of the case member, nesting the sealing function directly into the existing structural opening rather than adding external sealing layers. This nested approach allows the sealing mechanism to occupy minimal additional volume while effectively preventing dust and water intrusion through the wiring path
3Reliability
If traditional sealing structures are used, then the sealing performance is improved, but the ease of manufacture decreases
Solution Approach 1:
The grommet is pre-formed with its sealing characteristics and protective features before installation. This preliminary preparation of the sealing component allows for straightforward installation into the opening without requiring complex assembly steps or specialized installation equipment, thereby improving ease of manufacture while maintaining effective sealing performance
Solution Approach 2:
The grommet is designed to self-seal the opening through its inherent elastic or deformable properties, automatically forming a tight seal around the wiring path when installed. This self-sealing mechanism eliminates the need for additional sealing operations or complex fastening procedures, simplifying the manufacturing and installation process while ensuring reliable dust and water protection
Data Source
AI summary
An electronic device is provided. The electronic device includes a case member that includes an opening, an electric component provided on the case member, and a circuit board connected to the electric component via the opening, wherein a portion of the circuit board contacts the case member to seal the opening.