Circuit Board with Segmented Insulating Layers for LED Heat Dissipation
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Solution Overview
Problem
Conventional circuit boards, including metal-based and ceramic-based ones, face high thermal resistance issues due to low thermal conductivity of insulating layers, which hampers heat dissipation in large-power LED illuminating devices, and are prone to damage and high weight.
Innovation Solution
A circuit board design featuring a metal base with a recessed region for a high thermal conductivity ceramic insulating layer and a flat region for a low thermal conductivity polymer insulating layer, connected through a joint layer, allowing for targeted heat dissipation and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a polymer insulating layer is used in the circuit board, then electrical insulation is achieved, but thermal resistance increases due to low thermal conductivity
Solution Approach 1:
The patent applies local quality by creating different regions with different insulating layer configurations: a first region with a thick first insulating layer for electrical insulation, and a second region with a thin second insulating layer for heat dissipation. This allows simultaneous achievement of electrical insulation and reduced thermal resistance in different locations of the circuit board.
Solution Approach 2:
The insulating layer is segmented into two distinct parts: a first insulating layer made of polymer material for electrical insulation, and a second insulating layer made of ceramic material for thermal conduction. This segmentation allows each layer to perform its specialized function independently, resolving the contradiction between insulation and heat dissipation.
2Temperature
If a ceramic-based circuit board is used, then thermal conductivity is improved compared to polymer, but the board becomes more fragile and heavier
Solution Approach 1:
The patent uses composite materials by combining polymer and ceramic insulating layers. The polymer layer provides flexibility and resistance to fragility, while the ceramic layer provides enhanced thermal conductivity. This composite structure achieves the thermal performance of ceramic boards without the complete fragility and weight penalties.
Solution Approach 2:
Ceramic material is applied locally only in the second region where heat dissipation is critical, rather than throughout the entire circuit board. This localized application provides thermal conductivity improvements where needed while maintaining the overall flexibility and reduced fragility of the polymer-based board structure.
3Reliability
If the insulating layer thickness is increased for better electrical insulation, then insulation performance improves, but thermal resistance increases
Solution Approach 1:
The insulating structure is segmented into two layers with different thicknesses and materials: the first insulating layer is thicker for electrical insulation, while the second insulating layer is thinner and made of high thermal conductivity ceramic for heat dissipation. This segmentation allows independent optimization of electrical and thermal properties.
Solution Approach 2:
The composite insulating structure combines polymer and ceramic materials with different thicknesses. The polymer layer provides electrical insulation with greater thickness, while the ceramic layer provides thermal conduction path with reduced thickness, achieving both insulation performance and thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces thermal resistance, enabling efficient heat dissipation from high-power electronic components while maintaining structural rigidity and low weight, thus prolonging the service life of illuminating devices.
Implementation Method 1
the first insulating layer and the second insulating layer have different thermal conductivities... the first insulating layer has a higher thermal conductivity than the second insulating layer... heat generated by an operative electronic component mounted in such circuit board can be quickly conducted to the external environment
Implementation Method 2
the base is made from a metal... metal is characterized by a high thermal conductivity and high rigidity... the thermal conductivity of the metal base can reach 140-398 K/(W*m)... heat generated by an operative electronic component mounted in such circuit board can be quickly conducted to the external environment
Data Source
AI summary
Various embodiments relate to a circuit board, including a base and a heat-conducting layer. The base has a first region and a second region on one side thereof facing the heat-conducting layer, the first region is recessed with respect to the second region, a first insulating layer is accommodated in the first region, a second insulating layer is formed on the second region, and the first insulating layer and the second insulating layer have different thermal conductivities. In addition, various embodiments further relate to an electronic module and an illuminating device including such circuit board. Various embodiments also relate to a method for manufacturing such circuit board.