Circuit Board Shape Retention Unit for Hard Disk Drives
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Solution Overview
Problem
Circuit boards used in hard disk drives face challenges in thinning while maintaining mechanical strength, as removing metal from the supporting substrate to reduce rigidity can lead to deformation and lack of mechanical strength.
Innovation Solution
A circuit board design featuring a metal supporting substrate with an open area, a second insulating layer, and a reinforcing layer that bridges the substrate, allowing for narrowing of the shape retention unit while maintaining mechanical strength through the use of polyimide resin and copper materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If part of the metal supporting substrate is removed to achieve lower rigidity, then the circuit board can be thinned and flexibility improved, but mechanical strength is reduced and deformation occurs
Solution Approach 1:
The patent applies composite materials by combining the metal supporting substrate with an insulating material (such as polyimide resin) to form a hybrid structure. The insulating material is filled into the recessed portion of the metal substrate, creating a composite region that provides both the flexibility needed for thinning and the mechanical strength to prevent deformation. This composite approach allows the circuit board to achieve lower rigidity while maintaining structural integrity.
Solution Approach 2:
The patent implements local quality by creating a recessed portion in the metal supporting substrate at specific locations where flexibility is needed, while maintaining the original metal structure in other areas for strength. The insulating material is selectively filled into this recessed portion, providing localized flexibility enhancement without compromising the overall mechanical strength of the circuit board. This localized modification allows precise control over rigidity distribution.
2Volume of moving object
If the width of the shape retention unit is narrowed to thin the circuit board, then flexibility and thinning are achieved, but mechanical strength is compromised
Solution Approach 1:
The shape retention unit is constructed as a composite structure combining the metal supporting substrate with the insulating material filled in the recessed portion. This composite construction allows the unit to maintain adequate width for mechanical strength while the overall circuit board achieves thinning. The insulating material contributes to the load-bearing capacity, enabling the unit to be thinner than a pure metal structure would require.
Solution Approach 2:
The patent introduces a vertical dimension by creating a recessed portion in the metal substrate and filling it with insulating material. This dimensional change allows the shape retention unit to have varied thickness profiles - thinner in the recessed areas for flexibility and thinning, while maintaining sufficient structural depth in other regions for mechanical strength. The multi-level structure resolves the contradiction between thinning and strength maintenance.
Data Source
AI summary
The problem of the present invention is to provide a circuit board comprising a shape retention unit capable of thinning while maintaining mechanical strength. The present invention solves the above-mentioned problem by providing a circuit board comprising a metal supporting substrate, a first insulating layer formed on the above-mentioned metal supporting substrate, and a wiring layer formed on the above-mentioned first insulating layer, wherein an open area is formed in the above-mentioned metal supporting substrate, and the circuit board comprises a shape retention unit having a second insulating layer contacting with the above-mentioned metal supporting substrate and a reinforcing layer formed on the above-mentioned second insulating layer, and bridging the above-mentioned metal supporting substrate divided by the above-mentioned open area.