Circuit Board Shield Contacts for Heat Dissipation and Noise Blocking
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Solution Overview
Problem
Existing electronic devices face challenges in preventing noise leakage from the opening of the circuit board shield, which is necessary for heat dissipation, as conventional noise countermeasures are inadequate for these openings.
Innovation Solution
The implementation of a heat dissipation device with a heat receiving surface in contact with the IC chip, fixed to the circuit board shield via fixing portions and protruding contact portions, forms a shield structure that prevents noise leakage through the openings by ensuring stable contact and blocking electromagnetic waves.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If an opening is formed in the circuit board shield for heat dissipation, then heat dissipation performance is improved, but noise leakage increases
Solution Approach 1:
The heat dissipation device serves as an intermediary element that bridges the IC chip and the external environment. It provides a dedicated thermal conduction path through its heat receiving surface contact with the IC chip, while its surrounding structure acts as a noise barrier. The fixing portions and protruding contact portions create multiple contact points that form an electromagnetic shield around the opening, allowing heat to escape while blocking noise leakage.
2Stability of the object's composition
If the heat dissipation device is fixed to the circuit board shield, then structural stability is improved, but noise leakage prevention becomes more difficult
Solution Approach 1:
The fixing structure is segmented into multiple discrete fixing portions distributed around the IC chip opening. Each fixing portion creates a localized contact point between the heat dissipation device and the circuit board shield. This segmentation allows the structure to achieve overall stability through multiple distributed connections while maintaining gaps between individual contact points that can be managed for electromagnetic shielding purposes.
Solution Approach 2:
The protruding contact portions are nested within the structure formed by the fixing portions. The protruding contact portions extend from the heat dissipation device toward the circuit board shield, creating additional contact points that are nested within the overall fixing structure. This nested arrangement enhances both structural stability and noise shielding by creating multiple nested layers of contact and potential electromagnetic barrier.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents noise from leaking to the outside of the circuit board shield, enhancing noise countermeasures and maintaining effective heat dissipation.
Implementation Method 1
the heat receiving surface being located at the opening and in contact with the IC chip
Implementation Method 2
noise countermeasures (EMI countermeasures) for blocking noise such as electromagnetic waves emitted from IC chips
Data Source
AI summary
Provided is an electronic device capable of preventing noise from leaking from the opening of a circuit board shield. An IC chip is disposed at an opening of a circuit board shield, and a plurality of fixing portions formed in a shield plate of a heat dissipation device are disposed to surround the IC chip. At least one protruding contact portion is formed between two adjacent fixing portions. The heat dissipation device and the circuit board shield are in contact with each other through the fixing portions and the protruding contact portion.