Circuit Board Panel Separation With Shielded Overhanging Components
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Solution Overview
Problem
Existing methods for fabricating circuit board arrangements for implantable medical devices face challenges in efficiently processing circuit board panels without damaging components during separation, particularly when large components extend beyond the board edges, risking damage from excision devices like lasers.
Innovation Solution
A method involving a circuit board panel with support portions and shield elements is used, where shield elements are placed to protect components from excision devices, allowing for separation while minimizing component damage, and are discarded with the remaining panel section.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pre-rout openings are formed in the circuit board panel to allow separation, then components can be placed without damage risk, but the circuit board panel becomes weaker and processing becomes difficult
Solution Approach 1:
The support portion is segmented into a first portion extending to the edge and a second portion extending to the component, creating distinct functional zones that allow separation while maintaining structural integrity during processing
Solution Approach 2:
The support portion has non-uniform geometry with different extents in different directions, providing localized support where needed while allowing separation where required, optimizing both processing ease and component protection
2Ease of manufacture
If the circuit board section is fully supported by the remaining panel section, then processing is easier, but separation becomes more complex and time-consuming
Solution Approach 1:
The support portion is divided into two segments with different extents, creating a natural separation path that simplifies the excision process while maintaining adequate support during processing
Solution Approach 2:
The support portion geometry is pre-configured with the first portion extending to the edge and second portion to the component, preparing the structure in advance for efficient separation without requiring additional processing steps
3Reliability
If the circuit board section is partially separated before component placement, then component damage risk is reduced, but additional processing steps are required
Solution Approach 1:
The support portion is pre-formed with the dual-extent geometry before component placement, eliminating the need for separate partial separation steps while still providing component protection during manufacturing
Solution Approach 2:
The support portion simultaneously provides structural support during processing and defines the separation path, combining multiple functions into a single geometric feature that simplifies the overall process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures reliable and efficient separation of circuit board sections with reduced risk of component damage, improving manufacturing yield and reducing costs by using sacrificial shield elements.
Implementation Method 1
an excise device such as a laser device is used to excise the circuit board panel
Data Source
AI summary
A method for fabricating a circuit board arrangement includes: providing a circuit board panel forming at least one circuit board section, a remaining panel section and at least one support portion connecting the at least one circuit board section to the remaining panel section; placing at least one functional component on the at least one circuit board section; and separating the at least one circuit board section from the remaining panel section at the at least one support portion using an excise device, wherein a portion of the at least one functional component extends beyond an edge of the at least one circuit board section, and at least one shield element is arranged on the circuit board panel such a shield element of the at least one shield element is at least partly arranged between the at least one functional component and the edge of the circuit board section.