High Frequency Circuit Board Shielding Films Lateral Connection

Solution Overview

Problem

High-frequency circuit boards experience signal distortion due to leaky waves on their lateral sides, which compromise signal transmission integrity as frequencies increase, necessitating a solution to prevent signal loss.

Innovation Solution

A circuit board design incorporating a first and second shielding film, electrically connected at the lateral side of a wire region, where the films cover opposite surfaces and connect through openings or edges to form a barrier against leaky waves, ensuring signal integrity and facilitating manufacturing efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If the working frequency is increased to achieve higher signal transmission speed, then the signal transmission speed is improved, but leaky waves occur on the lateral sides of the circuit board causing signal distortion

Engineering Contradiction:

Core Design Contradiction:

SpeedVSReliability

Solution Approach 1:

The patent applies shielding films (conductive adhesive layers) on the lateral sides of the circuit board to block leaky waves. These thin film structures effectively prevent signal distortion caused by high-frequency leaky waves while maintaining the compact board design, thus preserving signal transmission integrity at high frequencies.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The shielding films are applied in advance to the lateral sides of the circuit board before signal transmission occurs. This preliminary protective measure prevents leaky waves from affecting signal integrity, allowing the circuit board to maintain reliable signal transmission at high frequencies without requiring additional corrective measures.

Inventive Principle:

Principle #9Preliminary anti-action

2Reliability

If shielding structures are added to prevent leaky waves, then signal transmission integrity is improved, but the device complexity and manufacturing difficulty increase

Engineering Contradiction:

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Instead of adding bulky metallic shielding structures, the patent uses thin conductive adhesive layers (shielding films) applied to the lateral sides of the circuit board. This approach provides effective leaky wave protection while maintaining a compact, simple board structure and avoiding significant increases in device complexity.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent replaces traditional mechanical shielding structures with a chemical/adhesive-based shielding film application method. The conductive adhesive layers are applied using printing or coating techniques rather than assembling mechanical components, thereby simplifying the overall device structure and reducing manufacturing complexity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If traditional shielding methods are used, then leaky waves are blocked, but the manufacturing process becomes more complex and production efficiency decreases

Engineering Contradiction:

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent replaces traditional mechanical shielding assembly processes with a printing or coating-based application method for conductive adhesive layers. This allows shielding films to be applied directly during the circuit board manufacturing process, eliminating separate assembly steps and significantly improving production efficiency while maintaining effective leaky wave protection.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The shielding film application is merged with the existing circuit board manufacturing process. The conductive adhesive layers are applied to the lateral sides during the same production run, combining the shielding function with the base board fabrication, thereby eliminating additional manufacturing steps and maintaining high production efficiency.

Inventive Principle:

Principle #5Merging (Combining)

4Weight of stationary object

If the circuit board structure is made lighter and thinner, then the device portability is improved, but the ability to shield against leaky waves at high frequencies is reduced

Engineering Contradiction:

Core Design Contradiction:

Weight of stationary objectVSReliability

Solution Approach 1:

The patent uses thin conductive adhesive layers (shielding films) applied to the lateral sides of the circuit board. These thin films provide effective leaky wave protection without adding significant weight or thickness, thus maintaining the lightweight and thin profile of the circuit board while ensuring reliable high-frequency signal transmission.

Inventive Principle:

Principle #30Flexible shells and thin films

Data Source

PatentUS12127331B2Circuit board for high frequency transmission and shielding method

Publication Date: 2024.10.22

AI summary

The present disclosure provides a circuit board for high frequency transmission and a shielding method. The circuit board for high frequency transmission includes: a first shielding film, a second shielding film and a circuit board body. The circuit board body includes a first surface and a second surface that are arranged opposite to each other. The first shielding film covers the first surface, and the second shielding film covers the second surface. The circuit board body is provided with a wire region. The first shielding film and the second shielding film are in electrical connection at a lateral side of the wire region. Therefore, leaky waves at the lateral side of the circuit board body are effectively avoided, and the circuit board body is thin in structure.