Circuit Board Shielding Frame Laser Cutting Height Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for chamber division and shielding in circuit board manufacturing require excessive laser cutting height, leading to high processing costs and wear on laser heads due to direct cutting on the PCB surface.
Innovation Solution
A method involving the use of a shielding frame between function modules on a circuit board, where the plastic package material is cut to the surface of the shielding frame instead of the PCB, reducing the cutting height and incorporating a conducting material covered with insulation for effective shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If laser cutting is performed from the upper surface of the plastic package material to the surface of the PCB substrate, then chamber division and shielding are achieved, but the cutting height becomes excessively high causing laser head wear and high processing costs
Solution Approach 1:
The invention divides the shielding structure into two parts: a shielding frame fixed on the PCB substrate and plastic package material covering the function modules. The laser cutting is performed only on the plastic package material above the shielding frame, segmenting the cutting process into a smaller, more manageable height that reduces laser head wear while maintaining shielding effectiveness through the combined structure.
Solution Approach 2:
The shielding frame acts as an intermediary element between the PCB substrate and the plastic package material. It provides a intermediate surface for laser cutting, reducing the cutting height from the full thickness of plastic package material plus substrate to just the thickness of plastic package material above the frame, thereby reducing processing costs and laser head wear.
2Productivity
If direct laser cutting on PCB surface is performed, then chamber division is achieved, but processing time and laser head wear increase
Solution Approach 1:
The shielding structure is segmented into a frame on the substrate and plastic package material above it. Laser cutting is applied only to the plastic package material portion, significantly reducing the cutting height and processing time compared to cutting through the entire thickness to the substrate surface, thereby improving productivity without sacrificing shielding effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach decreases the cutting height, reduces processing time, and lowers costs by minimizing laser head wear, while maintaining effective chamber division and shielding, thus enhancing manufacturability and electromagnetic compatibility.
Implementation Method 1
performing laser cutting, by using, for example, laser, on a part that requires the chamber division
Implementation Method 2
covering an outside of the plastic package material that is not cut and a top part of the shielding frame with a conducting material
Implementation Method 3
covering an outside surface of the conducting material with an insulation material
Data Source
AI summary
Embodiments of the present invention disclose a method for manufacturing a circuit board, and a circuit board. The method includes: separately fixing at least two function modules and a shielding frame on a circuit board, where the shielding frame is located between the at least two function modules; packaging the at least two function modules and the shielding frame by using a plastic package material; cutting the plastic package material corresponding to the top of the shielding frame to a surface of the shielding frame; and covering an outside of the plastic package material and an top part of the shielding frame with a conducting material, and covering a surface of the conducting material with an insulation material. In the embodiments, the cutting height is decreased, the processing time is short, and good manufacturability is provided.