Circuit Board Shielding Zone Groove EMI Isolation
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Solution Overview
Problem
There is a need for an improved method to manufacture circuit boards that effectively shield electromagnetic interference (EMI) generating components without occupying excessive space, as existing methods like conductive casings and shielding layers have limitations in miniaturized devices.
Innovation Solution
A method involving a circuit board with defined shielding and non-shielding zones, where a groove is created between the zones to contain an insulating encapsulation layer, and an electrically conductive shielding layer is applied to couple with the ground connection, ensuring effective electromagnetic shielding without covering sensitive components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conductive casing is used to shield EMI-generating components, then electromagnetic shielding effectiveness is improved, but device space is consumed
Solution Approach 1:
The patent merges the shielding function with the circuit board structure itself by integrating a conductive shielding layer directly onto the circuit board substrate. This eliminates the need for separate conductive casings while maintaining electromagnetic shielding effectiveness, thereby saving device space.
Solution Approach 2:
The circuit board is designed to serve multiple functions: it provides mechanical support for electronic components, electrical connections through traces, and electromagnetic shielding through the integrated conductive shielding layer. This multi-functionality reduces the need for additional shielding structures.
2Object-affected harmful factors
If shielding zones are expanded to cover more components, then electromagnetic interference protection is improved, but space for non-shielding components is reduced
Solution Approach 1:
The patent applies local quality by creating distinct shielding zones only around specific EMI-generating components that require protection, rather than shielding the entire circuit board. This selective approach minimizes the area occupied by shielding structures while providing adequate protection where needed.
Solution Approach 2:
The circuit board is segmented into multiple zones: shielding zones around EMI-generating components, non-shielding zones for sensitive components, and transition zones with grooves. This segmentation allows optimized space utilization by applying shielding only where necessary.
3Reliability
If insulating encapsulation layer is applied to cover shielding zone, then component encapsulation is improved, but material overflow risk increases
Solution Approach 1:
The patent applies preliminary action by forming grooves in the circuit board before applying the insulating encapsulation layer. These pre-formed grooves act as containment structures that guide the encapsulation material and prevent it from overflowing into non-shielding zones, thereby improving manufacturing precision.
Solution Approach 2:
The grooves serve as intermediary structures between the shielding zone and non-shielding zone. They provide a physical barrier that mediates the flow of insulating material, allowing it to fill the shielding zone completely while preventing unwanted overflow into adjacent areas.
4Manufacturing precision
If groove is added to contain insulating material, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The grooves are formed as thin structural features within the circuit board substrate, utilizing the existing board thickness rather than adding significant external complexity. This approach provides effective material containment while minimizing impact on overall device dimensions and complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the risk of insulating material overflow and allows for efficient electromagnetic shielding of EMI-generating components, maintaining the functionality of non-shielding zone components while optimizing space usage in miniaturized devices.
Implementation Method 1
applying an electrically conductive shielding layer on top of at least part of the encapsulation layer and to the ground connection so as to electrically couple the shielding layer to the ground connection, whereby the one or more shielding-zone electronic components are electromagnetically shielded
Data Source
AI summary
A method comprises: providing a circuit board comprising a first surface, an opposing second surface, and a ground connection; defining a shielding zone and a non-shielding zone on the first surface, one or more shielding-zone electronic components being comprised within the shielding zone; providing a groove in the circuit board, the groove extending along at least part of the shielding zone and being in-between the shielding zone and the non-shielding zone; applying an insulating encapsulation layer to cover the shielding zone, whereby the one or more shielding-zone electronic components are encapsulated; applying an electrically conductive shielding layer on top of at least part of the encapsulation layer and to the ground connection so as to electrically couple the shielding layer to the ground connection, whereby the one or more shielding-zone electronic components are electromagnetically shielded. Further, disclosed is a circuit board, and a hearing device comprising a circuit board.