Circuit Board Shielding via Conductive Vias
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Solution Overview
Problem
The existing manufacturing processes for circuit boards with electromagnetic shielding layers are complex and costly due to the need for mounting legs and receiving grooves, which increase production complexity and costs.
Innovation Solution
A method involving a copper substrate with blind holes filled with conductive vias, followed by the formation of electromagnetic shielding units with conductive posts that are mounted on solder pads and connected to the inner wiring layer via an adhesive layer, simplifying the process and reducing costs by eliminating the need for traditional mounting legs and grooves.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional mounting legs and receiving grooves are used to connect the electromagnetic shielding layer to the circuit board, then the electromagnetic shielding layer can be securely connected, but the manufacturing cost and process complexity increase
Solution Approach 1:
The patent merges the electromagnetic shielding layer with the circuit board by forming conductive vias that pass through both layers, integrating them into a single unified structure. This eliminates the need for separate mounting legs and receiving grooves, reducing manufacturing complexity while maintaining secure connection through the integrated via structure
Solution Approach 2:
The patent extracts and eliminates the unnecessary mounting legs and receiving grooves from the traditional design. By using conductive vias formed directly through the circuit board and electromagnetic shielding layer, the design removes redundant components while achieving the same connection function more efficiently
2Reliability
If traditional mounting legs and receiving grooves are used to connect the electromagnetic shielding layer, then secure connection is achieved, but manufacturing cost increases
Solution Approach 1:
The patent combines the electromagnetic shielding layer and circuit board into a single integrated structure using conductive vias, eliminating the need for separate mounting components. This integration reduces the number of parts and assembly steps, directly lowering manufacturing costs while maintaining secure connection
Solution Approach 2:
The conductive vias serve multiple functions simultaneously: they provide electrical connection, mechanical attachment, and electromagnetic shielding integration. This multi-functionality eliminates the need for dedicated mounting legs and receiving grooves, reducing component count and manufacturing cost
Data Source
AI summary
A circuit board with anti-EMI proofing for each component on the board includes a first outer wiring layer, electronic components mounted on the first outer wiring layer, and at least one electromagnetic shielding unit. Each electromagnetic shielding unit has a shielding layer and conductive posts formed on the shielding layer, the shielding layer and conductive posts defining a receiving space to house and shield one electronic component. An adhesive layer formed on the first outer wiring layer bonds each electromagnetic shielding unit to the first outer wiring layer.