Circuit Board Side Wall EMI Shielding via Adhesive Metal Layers
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Solution Overview
Problem
5G electronic devices face challenges in enhancing signal anti-interference abilities due to high-frequency and high-speed requirements, which existing circuit board manufacturing methods fail to adequately address.
Innovation Solution
A method for manufacturing circuit boards involves forming laminated structures with insulating layers and metal layers, followed by the creation of inner and outer wiring layers, and the integration of electromagnetic interference shielding layers without the need for shielding holes, using adhesive layers to connect metal layers and ensure effective shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If shielding holes are used for electromagnetic interference shielding, then shielding effectiveness is improved, but manufacturing complexity and defect risk increase
Solution Approach 1:
The patent extracts the shielding function from traditional shielding holes and relocates it to the side walls of the circuit board. By forming shielding layers on the side walls using adhesive layers and metal layers, the design eliminates the need for shielding holes while maintaining shielding effectiveness. This extraction approach removes the source of manufacturing complexity and defect risk associated with punching shielding holes.
Solution Approach 2:
The patent transitions from planar shielding (holes in the board) to three-dimensional shielding by utilizing the side walls of the circuit board. The shielding structure extends vertically along the side walls, creating a dimensional change that provides effective electromagnetic interference shielding without requiring holes in the board surface, thereby simplifying the manufacturing process.
2Ease of manufacture
If copper plating is used for shielding, then manufacturing simplicity is improved, but shielding stability and effectiveness deteriorate
Solution Approach 1:
The patent employs a composite shielding structure combining adhesive layers and metal layers on the side walls, replacing simple copper plating. This composite approach provides more stable and effective shielding while maintaining manufacturing feasibility. The adhesive layer serves as a bonding medium that ensures the metal layer remains firmly attached, creating a reliable shielding structure that is more stable than conventional copper plating methods.
3Object-affected harmful factors
If shielding holes are punched in the circuit board, then electromagnetic interference shielding is achieved, but wiring space and product reliability decrease
Solution Approach 1:
The patent extracts the shielding function from the board surface (removing the need for shielding holes) and implements it through side wall shielding structures. This extraction eliminates the punching operation that causes product defects and maintains wiring space integrity, while still achieving effective electromagnetic interference shielding through the side wall metal layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the circuit board's ability to prevent electromagnetic interference, increases wiring space, and reduces the risk of product defects associated with punching, while providing a more stable shielding structure compared to simple copper plating methods.
Implementation Method 1
forming a circuit board by pressing the first single-sided board to the insulating structure
Data Source
AI summary
A method for manufacturing a circuit board comprises: a first single-sided board and an insulating structure are provided. The first single-sided board is pressed to the insulating structure and covers opposite side surfaces of the insulating structure to form a first laminated board. A second single-sided board and a third single-sided board are provided. The second single-sided board is pressed to the third single-sided board and covers opposite side walls of the third single-sided board to form a second laminated board. An inner wiring layer is formed by the second laminated board. The second laminated board with the inner wiring layer and the first laminated board are pressed to form an intermediate structure. Outer wiring layers are formed by the intermediate structure. Covering films are formed on surfaces of the outer wiring layers. Electromagnetic interference shielding layers are formed on the covering films.