Circuit Board Layer Layout for Touch and Display Signal Isolation
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Solution Overview
Problem
The interference between high-frequency touch and display protocol signals on circuit boards affects the operation stability of electronic devices due to unreasonable wire distribution.
Innovation Solution
The circuit board design ensures that the projections of the touch wire and display protocol wire do not overlap in the thickness direction by controlling their wiring paths, using a multi-layer structure, ground wires, and strategically placing connectors and fingerprint holes to minimize signal interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the touch wire and display protocol wire are closely arranged to achieve miniaturization, then the device size is reduced, but signal interference occurs between the high-frequency signals
Solution Approach 1:
The patent applies dimensionality change by transitioning from planar wire arrangement to three-dimensional spatial separation. Specifically, the touch wire is routed on the front surface of the circuit board while the display protocol wire is routed on the back surface, utilizing the thickness dimension to achieve physical separation. This resolves the contradiction by maintaining close overall arrangement for miniaturization while preventing signal interference through vertical dimension separation.
2Ease of manufacture
If the touch wire and display protocol wire are routed on the same layer to simplify structure, then manufacturing is easier, but signal interference increases
Solution Approach 1:
The patent applies segmentation by dividing the circuit board into distinct routing zones: the front surface for touch wire routing and the back surface for display protocol wire routing. This spatial segmentation separates the high-frequency signal paths, eliminating mutual interference while maintaining manufacturing simplicity through clear zone definition and standardized routing practices in each region.
3Reliability
If the wire distribution is optimized to reduce interference, then signal transmission stability improves, but the wiring complexity increases
Solution Approach 1:
The patent utilizes the thickness dimension of the circuit board to resolve wiring complexity. By routing touch wires on the front surface and display protocol wires on the back surface, the solution achieves signal isolation without requiring complex routing patterns within the same plane. The wiring paths remain relatively simple in each zone while benefiting from three-dimensional separation for improved signal stability.
Data Source
AI summary
A circuit board, a display panel and an electronic device. The electronic device includes a housing and a display panel fixed to the housing. The display panel includes a display module and a circuit board, and the display module is electrically connected to the circuit board. The circuit board includes a touch wire and a display protocol wire, and a projection of the touch wire and a projection of the display protocol wire in the thickness direction are not overlapped. The problem of the signal interference resulting from that there is an overlapping part between the touch wire and the display protocol wire in the thickness direction is avoided.