Circuit Board Adhesion via Silver Intermediate Layer
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Solution Overview
Problem
Conventional circuit boards have a weak adhesive force between the copper wiring layer and the insulating substrate, which affects the reliability and durability of the circuit board.
Innovation Solution
The method involves forming silver layers on both surfaces of the insulating substrate, creating a silver conductive structure through-holes to connect the layers, and then forming a copper wiring layer on top, with a silver wiring layer etched to increase bonding force between the copper wiring layer and the substrate, using specific etching liquids to prevent damage and enhance adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional copper wiring layer is directly connected to the insulating substrate, then the manufacturing process is simple, but the adhesive force between the copper wiring layer and the insulating substrate is not strong enough
Solution Approach 1:
The patent applies composite materials by creating a multi-layer structure consisting of insulating substrate, silver conductive structure, and copper wiring layer. The silver conductive structure serves as an intermediate layer that enhances the adhesive force between the copper wiring layer and the insulating substrate, solving the problem of weak adhesion in conventional direct connections.
Solution Approach 2:
The silver conductive structure acts as an intermediary layer between the copper wiring layer and the insulating substrate. This intermediate structure improves the bonding force and structural integrity, preventing direct contact between copper and the substrate while enhancing adhesion through the silver layer.
2Reliability
If silver layers and copper wiring layer are formed with multiple processing steps, then the bonding force is enhanced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent applies preliminary action by forming the silver conductive structure on the insulating substrate before forming the copper wiring layer. This preliminary preparation of the silver layer creates a foundation that ensures strong bonding when the copper layer is subsequently formed, improving structural integrity while organizing the manufacturing steps in a logical sequence.
Solution Approach 2:
The manufacturing process is segmented into distinct steps: forming the silver conductive structure first, then forming the copper wiring layer on top. This segmentation allows each layer to be optimized independently while ensuring proper adhesion between layers, balancing manufacturing complexity with structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly enhances the bonding force between the copper wiring layer and the insulating substrate, improving the structural integrity and reliability of the circuit board.
Implementation Method 1
creating a silver conductive structure through-holes to connect the layers, and then forming a copper wiring layer on top, with a silver wiring layer etched to increase bonding force
Data Source
AI summary
A method for manufacturing the circuit board comprises following steps of forming a silver layer on each of two opposite surfaces of an insulating substrate, and forming a copper layer on each silver layer, thereby obtaining a middle structure; defining at least one through-hole on the middle structure, and each through-hole extending through each copper layer; forming a copper wiring layer on the copper layers to cover each through-hole and a portion region of the copper layers, the copper wiring layer comprising a copper conductive structure passing through each through-hole, the copper conductive structure connecting the copper layers; removing the copper layers not covered by the copper wiring layer; and etching the silver layers to form a silver wiring layer corresponding to the copper wiring layer, wherein a first etching liquid, which does not etch the copper wiring layer, is used for etching the silver layers.