Wiring Circuit Board Insulation Layout Against Solder Bridging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In conventional wiring circuit boards, as fine pitch advances, there is a risk of short circuits between terminals due to solder flow during melting, leading to potential short circuits between adjacent terminals.
Innovation Solution
The wiring circuit board design includes a first insulating layer with exposed portions and a third insulating layer positioned between terminals to prevent solder flow, guiding molten solder away from adjacent terminals and concentrating it in a narrower path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If fine pitch terminals are used to increase integration density, then productivity and compactness are improved, but the risk of solder short circuits between adjacent terminals increases
Solution Approach 1:
A third insulating layer is introduced as an intermediary barrier between adjacent terminals and exposed wire portions. This layer prevents direct contact between molten solder from one terminal and adjacent terminals or exposed conductive portions, thereby eliminating the short circuit risk while maintaining fine pitch terminal spacing for high integration density
Solution Approach 2:
The insulating structure is segmented into multiple functional layers: a second insulating layer covering the wire body, and a third insulating layer specifically positioned between terminals and exposed portions. This segmentation allows each layer to perform its specific function - the second layer provides general insulation while the third layer provides targeted short circuit prevention in critical areas
2Reliability
If solder is applied to terminals for electrical connection, then electrical conductivity is improved, but molten solder may flow to adjacent terminals causing short circuits
Solution Approach 1:
The third insulating layer acts as a physical barrier between the solder on terminals and adjacent terminals or exposed wire portions. This intermediary layer allows electrical connection to be established through proper soldering while preventing the harmful lateral flow of molten solder that would cause short circuits
Solution Approach 2:
The third insulating layer is pre-positioned between terminals and exposed portions before soldering occurs. This preliminary protective measure counteracts the potential harmful effect of solder flow before it can occur, preventing short circuits while allowing the soldering process to proceed for reliable electrical connection
Data Source
AI summary
A wiring circuit board includes a first insulating layer, a circuit pattern, a second insulating layer, and a third insulating layer. The circuit pattern includes a first terminal, a first wire connected to the first terminal, and a second terminal spaced apart from the first terminal. The first wire includes a first body portion covered with the second insulating layer, and a first exposed portion disposed between the first terminal and the first body portion and exposed from the second insulating layer. The third insulating layer is disposed between the first exposed portion and the second terminal, and is disposed between the first terminal and the second terminal.