Circuit Board Supporter Fixation Using a Solder Mask Coupler
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Solution Overview
Problem
Conventional adhesive-based fixation of supporters in package structures is challenging due to difficulty in controlling adhesive amount, leading to potential short circuits and reliability issues from adhesive overflow or insufficiency.
Innovation Solution
A circuit board structure where a supporter is fixed on a substrate using a solder mask coupler formed from a solder mask material, eliminating the need for adhesives by utilizing the stickiness of the uncured solder mask material to secure the supporter.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive is used to fix the supporter on the substrate, then the supporter can be secured, but the adhesive amount is difficult to control leading to overflow or insufficiency
Solution Approach 1:
The patent removes the adhesive from the system entirely and replaces it with a solder mask material that provides both fixation and insulation functions. The supporter is fixed directly to the substrate using the solder mask material, eliminating the need for separate adhesive application and avoiding all associated control issues.
Solution Approach 2:
The solder mask material serves multiple functions simultaneously: it acts as a fixation material to secure the supporter, provides electrical insulation, and serves as a protective coating. This multi-functionality eliminates the need for separate adhesive and insulation layers, simplifying the structure and improving reliability.
2Reliability
If adhesive is used to fix the supporter, then the supporter can be secured, but adhesive overflow may attach onto conductors causing short circuits
Solution Approach 1:
The adhesive is completely removed from the system and replaced with solder mask material that has inherent insulating properties. This eliminates the harmful effect of adhesive overflow onto conductors, as the solder mask material itself provides electrical insulation even when it contacts conductive elements.
Solution Approach 2:
The patent converts the potential harm of material overflow into a benefit by using solder mask material that, even if it contacts conductors, provides electrical insulation rather than causing short circuits. The material's insulating properties transform what would be a harmful situation into a protective one.
3Ease of manufacture
If adhesive is used with insufficient amount, then manufacturing is simpler, but the reliability of the package structure is negatively influenced
Solution Approach 1:
The adhesive is removed and replaced with solder mask material that is applied as a coating process. This eliminates the need for precise adhesive amount control, as the solder mask material can be applied uniformly and provides both fixation and insulation functions, ensuring reliability without complex process control.
Solution Approach 2:
The solder mask material provides multiple functions (fixation and insulation) simultaneously, so that even with simple application processes, the reliability is maintained through the material's inherent insulating properties and adequate bonding capability.
4Reliability
If adhesive is used to fix the supporter, then the supporter can be secured, but the structural design becomes more complex
Solution Approach 1:
The solder mask material serves as both the fixation material and the insulating layer, eliminating the need for separate adhesive and insulation components. This reduces the number of parts and simplifies the overall package structure while maintaining or improving reliability through the integrated design.
Solution Approach 2:
The patent merges the functions of adhesive and insulating material into a single solder mask material layer. This consolidation reduces structural complexity by eliminating interfaces between different materials and simplifying the assembly process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances coupling force between the supporter and substrate, simplifies manufacturing, and prevents adhesive-related issues by using a solder mask coupler that can withstand higher shear forces compared to traditional adhesives.
Implementation Method 1
the supporter is fixed on the substrate via the solder mask coupler
Implementation Method 2
subjecting the solder mask material to a solidification process, so as to form a solder mask coupler from the solder mask material
Data Source
AI summary
A circuit board structure is provided. The circuit board structure includes a substrate, a solder mask coupler, a supporter, and a chip. The substrate has a conductive structure. The solder mask coupler is disposed on the substrate. The supporter contacts the solder mask coupler, and the supporter is fixed on the substrate via the solder mask coupler. The chip is disposed on the substrate, and the chip is electrically connected with the conductive structure.