Circuit Board Solder Resist Support for Fine-Line Stability
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Solution Overview
Problem
Conventional circuit boards with fine circuit patterns at the outermost portion are prone to collapse due to lack of support, especially in multi-layer structures, which is a challenge for applications in 5G communication systems requiring high integration and reliability.
Innovation Solution
A circuit board structure with a solder resist that includes a first part exposing the outer layer circuit pattern and a second part covering it, where the first part has a convex shape to provide support and protection, and a primer layer enhances bonding strength, preventing collapse and improving reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the circuit pattern is made fine to increase circuit integration, then the circuit line width is reduced, but the outermost circuit pattern becomes prone to collapse
Solution Approach 1:
The patent applies beforehand cushioning by forming a support layer beneath the outermost circuit pattern before the pattern is completed. This support layer acts as a protective cushion that prevents collapse during subsequent manufacturing processes and handling, allowing fine circuit patterns to be manufactured without compromising their structural stability
Solution Approach 2:
The support layer serves as an intermediary element between the insulating layer and the outermost circuit pattern. It mediates the mechanical stress and provides structural reinforcement to the fragile fine circuit pattern, enabling the pattern to maintain its integrity while achieving the desired fine line width
2Ease of operation
If the circuit pattern protrudes above the insulating layer to be accessible, then the circuit can be connected, but the outermost circuit pattern easily collapses
Solution Approach 1:
The support layer is formed beforehand to provide cushioning and structural support to the protruding circuit pattern. This allows the circuit to remain accessible for connection while preventing collapse during handling and assembly operations
Solution Approach 2:
The patent creates a composite structure consisting of the insulating layer, support layer, and circuit pattern. This composite construction combines the electrical functionality of the circuit with the mechanical strength of the support layer, enabling both accessibility and stability
3Reliability
If the solder resist covers the entire outer layer to protect the circuit, then the circuit pattern is protected, but the outermost circuit pattern cannot be accessed for connection
Solution Approach 1:
The solder resist is segmented into different regions: a first region that exposes the outermost circuit pattern for connection and a second region that covers other areas for protection. This segmentation allows different portions of the outer layer to have different functions - accessibility where needed and protection where not needed
Solution Approach 2:
The solder resist is applied with local quality variations - it is removed or not formed in the first region to maintain circuit accessibility, while being present in the second region to provide protection. This localized application optimizes both protection and accessibility requirements
Data Source
AI summary
A circuit board including an insulating layer including a first region and a second region; a plurality of outer layer circuit patterns disposed on upper surfaces of the first region and the second region of the insulating layer; and a solder resist including a first part disposed on the first region of the insulating layer and a second part disposed on the second region of the insulating layer. The first part includes an upper surface having a curved surface and exposes an upper surface of an outer layer circuit pattern disposed on the first region of the insulating layer. The second part covers an upper surface of an outer layer circuit pattern disposed on the second region of the insulating layer, and at least a part of the upper surface of the first part is positioned lower than the upper surface of the outer layer circuit pattern.