Insulated Circuit Board Mounting Structure for Uniform Solder Support
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Solution Overview
Problem
Existing semiconductor devices face challenges in effectively supporting and securing insulated circuit boards on heat dissipation bases, leading to potential damage from stress and external impacts due to uneven solder thickness distribution and warping.
Innovation Solution
The semiconductor device incorporates a heat dissipation base with a top surface featuring inner and outer protrusions, where inner protrusions are positioned near the center and outer protrusions are composed of multiple sub-protrusions, supporting the circuit boards via solder to maintain consistent thickness and reduce stress points.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If protrusions are formed on the heat dissipation base to support circuit boards, then the circuit boards are secured and positioned, but stress concentration and potential damage occur at the support points
Solution Approach 1:
The outer protrusions are divided into multiple sub-protrusions (e.g., four sub-protrusions per outer protrusion). This segmentation distributes the support function across multiple smaller contact points, reducing stress concentration at any single point while maintaining overall support stability for the circuit boards.
Solution Approach 2:
Different types of protrusions (inner and outer) are strategically positioned at different locations on the heat dissipation base. The inner protrusions are placed near the center of placement areas while outer protrusions are positioned near the corners. This local differentiation optimizes support distribution and reduces stress concentration at critical edge locations.
2Reliability
If solder is used to join circuit boards to the heat dissipation base, then electrical and mechanical connection is achieved, but uneven solder thickness distribution causes warping and stress
Solution Approach 1:
Protrusions are pre-formed on the heat dissipation base before soldering the circuit boards. These protrusions serve as preliminary support structures that maintain proper spacing and positioning during the soldering process, ensuring uniform solder thickness distribution and preventing warping caused by uneven solder application.
3Reliability
If multiple protrusions are added to support circuit boards, then support stability improves, but device complexity increases
Solution Approach 1:
Multiple sub-protrusions are integrated into unified outer protrusion structures. Instead of treating each sub-protrusion as a separate complex element, they are merged into coordinated groups (e.g., four sub-protrusions forming one outer protrusion), simplifying the overall structure while maintaining enhanced support stability through the distributed sub-protrusion configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration stabilizes the circuit boards, minimizing damage from warping and external impacts by ensuring uniform solder thickness and balanced stress distribution, enhancing the reliability of the semiconductor device.
Implementation Method 1
a heat dissipation base having a top surface that has a rectangular shape in the plan view and includes a pair of first sides opposite to each other and a pair of second sides opposite to each other and perpendicular to the pair of first sides, the top surface having a plurality of rectangular placement areas in each of which a respective one of the plurality of insulated circuit boards is disposed via solder
Data Source
AI summary
A semiconductor device includes insulated circuit boards each having a rectangular shape in plan view and each including an insulating plate and a metal plate, and a heat dissipation base having a top surface having rectangular placement areas in each of which one of the insulated circuit boards is disposed via solder. The top surface has inner protrusions and outer protrusions, and each outer protrusion includes sub-protrusions. Each outer protrusion is disposed at one of four corners of placement areas that is closest to one of four corners of the top surface, and each inner protrusion is disposed at one of four corners of placement areas in which any outer protrusion is not disposed.