Circuit Board Spring Damper Mounting for Shock Isolation

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Solution Overview

Problem

Electronic components are vulnerable to shock and vibration due to increasing use in various products, necessitating effective mounting and retention systems that can absorb and isolate these disturbances.

Innovation Solution

A spring and damper system for circuit boards, comprising arcuate leaf springs connected by cross members and equipped with dampers to absorb shock and vibration, which are either attached separately or overmolded onto the springs, providing both mechanical support and damping effects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If rigid mounting systems are used to secure circuit boards, then mechanical strength and stability are improved, but vulnerability to shock and vibration increases

Engineering Contradiction:
Improvemechanical strengthVSAvoidshock and vibration vulnerability
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent changes the mechanical parameters of the mounting system by using spring elements instead of rigid mounts. The spring constant and damping coefficients are optimized to provide both structural support and vibration isolation, transforming the system from rigid to compliant while maintaining strength

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The mounting system combines spring elements with damping materials to create a composite structure that simultaneously provides mechanical support and shock absorption. This composite approach allows the system to maintain strength while reducing vulnerability to harmful vibrations

Inventive Principle:
Principle #40Composite materials

2Object-affected harmful factors

If spring elements are used to reduce shock and vibration, then vibration isolation is improved, but mechanical support capability deteriorates

Engineering Contradiction:
Improvevibration isolationVSAvoidmechanical support capability
Core Design Contradiction:
Object-affected harmful factorsVSStrength

Solution Approach 1:

The patent merges spring elements with damping elements into a unified mounting system. The spring component provides mechanical support and elasticity, while the damping component suppresses vibrations. This combination allows the system to simultaneously achieve both vibration isolation and adequate mechanical support capability

Inventive Principle:
Principle #5Merging (Combining)

3Adaptability or versatility

If multiple separate components are used for spring and damper systems, then functionality is improved, but device complexity increases

Engineering Contradiction:
ImprovefunctionalityVSAvoidsystem complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines spring elements and damper elements into an integrated mounting system that can be attached as a single assembly to the circuit board. This integration maintains the distinct functional properties of springs and dampers while reducing the number of separate components and simplifying the installation process

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The mounting system is designed as a universal solution that can be applied to various circuit board configurations and mounting scenarios. The standardized design allows the same basic structure to serve multiple functions across different applications, reducing overall system complexity while maintaining versatility

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system effectively isolates circuit boards from undesirable shock and vibration, ensuring reliable operation and electromagnetic compatibility by combining spring force and damping to secure components within enclosures.

Implementation Method 1

a spring arrangement (28) having a plurality of springs (30, 32)

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 2

A plurality of dampers (54, 56, 58, 60) are disposed on respective ends (38, 40, 42, 44) of the leaf springs (30, 32)

Methodology Applied
Scientific EffectDamping: Damping

Data Source

PatentUS11382223B2Spring and damper system and method for producing same
Publication Date: 2022.07.05 LEAR CORP
  • US11382223B2 patent drawing
  • US11382223B2 patent drawing
  • US11382223B2 patent drawing

AI summary

A spring and damper system for a circuit board includes a spring arrangement having a plurality of compression springs. Each of the compression springs has a contact portion and two ends which are disposed away from their respective contact portion. Each of a plurality of dampers is disposed on a respective one of the ends of the compression springs and configured to contact a portion of the circuit board.